Datasheets
TSXPC750AMGSB/Q8LE by:

RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360

Part Details for TSXPC750AMGSB/Q8LE by Atmel Corporation

Overview of TSXPC750AMGSB/Q8LE by Atmel Corporation

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Applications Industrial Automation

Part Details for TSXPC750AMGSB/Q8LE

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TSXPC750AMGSB/Q8LE Part Data Attributes

TSXPC750AMGSB/Q8LE Atmel Corporation
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TSXPC750AMGSB/Q8LE Atmel Corporation RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ATMEL CORP
Part Package Code CGA
Package Description CGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 83.3 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-X360
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code CGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 4.2 mm
Speed 200 MHz
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.5 V
Supply Voltage-Nom 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form UNSPECIFIED
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSXPC750AMGSB/Q8LE

This table gives cross-reference parts and alternative options found for TSXPC750AMGSB/Q8LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC750AMGSB/Q8LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSPC750AMGS8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSB/Q8LE vs TSPC750AMGS8LH
TSPC750AVGS8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSB/Q8LE vs TSPC750AVGS8LE
TSXPC750AVGS8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSB/Q8LE vs TSXPC750AVGS8LH
TSPC750AVGSU/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSB/Q8LE vs TSPC750AVGSU/T8LH
TSPC750AVGSU8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSB/Q8LE vs TSPC750AVGSU8LE
TSPC750AMGSU/T8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSB/Q8LE vs TSPC750AMGSU/T8LE
TSPC750AMGSU/T8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSB/Q8LE vs TSPC750AMGSU/T8LE
TSPC750AVGSU8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSB/Q8LE vs TSPC750AVGSU8LH
TSPC750AMGSB/Q8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSXPC750AMGSB/Q8LE vs TSPC750AMGSB/Q8LE
TSPC750AMGSU/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSB/Q8LE vs TSPC750AMGSU/T8LH
Part Number Description Manufacturer Compare
PPC7448HX1250NC 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor TSXPC750AMGSB/Q8LE vs PPC7448HX1250NC
TSPC750AVGB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSXPC750AMGSB/Q8LE vs TSPC750AVGB/Q12LE
PPC7448HX800NC 32-BIT, 800MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors TSXPC750AMGSB/Q8LE vs PPC7448HX800NC
TSXPC750AMGSU8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSB/Q8LE vs TSXPC750AMGSU8LE
IBM25PPC740-DB0M2000 RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM TSXPC750AMGSB/Q8LE vs IBM25PPC740-DB0M2000
IBM25PPC750L-GB433A2T RISC Microprocessor, 32-Bit, 433MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM TSXPC750AMGSB/Q8LE vs IBM25PPC750L-GB433A2T
TSPC750AMGSB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSB/Q8LE vs TSPC750AMGSB/Q12LE
PPC7448VU1000LD 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 Freescale Semiconductor TSXPC750AMGSB/Q8LE vs PPC7448VU1000LD
PC7410VG450LE RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSXPC750AMGSB/Q8LE vs PC7410VG450LE
PPC7448HX1000LC 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360 Freescale Semiconductor TSXPC750AMGSB/Q8LE vs PPC7448HX1000LC

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