Datasheets
TSPC750AMGSB/Q12LE by:

RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360

Part Details for TSPC750AMGSB/Q12LE by Atmel Corporation

Overview of TSPC750AMGSB/Q12LE by Atmel Corporation

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Part Details for TSPC750AMGSB/Q12LE

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TSPC750AMGSB/Q12LE Part Data Attributes

TSPC750AMGSB/Q12LE Atmel Corporation
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TSPC750AMGSB/Q12LE Atmel Corporation RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ATMEL CORP
Part Package Code CGA
Package Description CGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 83.3 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-C360
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code CGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 4.2 mm
Speed 266 MHz
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.5 V
Supply Voltage-Nom 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form C BEND
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSPC750AMGSB/Q12LE

This table gives cross-reference parts and alternative options found for TSPC750AMGSB/Q12LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC750AMGSB/Q12LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSXPC750AMGSB/T12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs TSXPC750AMGSB/T12LH
TSPC750AVGSB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group TSPC750AMGSB/Q12LE vs TSPC750AVGSB/Q12LE
TSPC750AVGSU/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group TSPC750AMGSB/Q12LE vs TSPC750AVGSU/T12LE
TSXPC750AMGSB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSPC750AMGSB/Q12LE vs TSXPC750AMGSB/T12LE
TSPC750AVGSB/T12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, CGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs TSPC750AVGSB/T12LH
TSPC750AVGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSPC750AMGSB/Q12LE vs TSPC750AVGS12LE
TSPC750AMGSU/T12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs TSPC750AMGSU/T12LH
TSPC750AMGSB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group TSPC750AMGSB/Q12LE vs TSPC750AMGSB/Q12LE
TSPC750AMGSB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs TSPC750AMGSB/T12LE
TSPC750AVGSU12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs TSPC750AVGSU12LE
Part Number Description Manufacturer Compare
TSXPC750AVGSB/T8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, CGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs TSXPC750AVGSB/T8LE
IBM25PPC750L-EB0B500W RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM TSPC750AMGSB/Q12LE vs IBM25PPC750L-EB0B500W
PC7447AVGH1333LB RISC Microprocessor, 32-Bit, 1333MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs PC7447AVGH1333LB
PC7448VSH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360 Teledyne e2v TSPC750AMGSB/Q12LE vs PC7448VSH1267ND
PCX7410MGSU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs PCX7410MGSU500LE
PCX7410MGU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs PCX7410MGU400LE
TSXPC750AVGU/T8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs TSXPC750AVGU/T8LE
PC755BMGS300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs PC755BMGS300LE
PC7447VGU1250LB RISC Microprocessor, 32-Bit, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGSB/Q12LE vs PC7447VGU1250LB
MPC755BRX300LE 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 Motorola Mobility LLC TSPC750AMGSB/Q12LE vs MPC755BRX300LE

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