Part Details for TSPC750AVG12LH by Thales Group
Overview of TSPC750AVG12LH by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC750AVG12LH
TSPC750AVG12LH CAD Models
TSPC750AVG12LH Part Data Attributes
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TSPC750AVG12LH
Thales Group
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Datasheet
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TSPC750AVG12LH
Thales Group
RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 83.3 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 266 MHz | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 2.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC750AVG12LH
This table gives cross-reference parts and alternative options found for TSPC750AVG12LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC750AVG12LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC750ARX266LX | 32-BIT, 266MHz, RISC PROCESSOR, CBGA360 | NXP Semiconductors | TSPC750AVG12LH vs MPC750ARX266LX |
| TSPC750AVGB/Q12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AVG12LH vs TSPC750AVGB/Q12LE |
| TSPC750AMGU/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | TSPC750AVG12LH vs TSPC750AMGU/T12LE |
| TSPC750AVGU12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AVG12LH vs TSPC750AVGU12LH |
| TSXPC750AVGB/Q12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AVG12LH vs TSXPC750AVGB/Q12LE |
| TSPC750AMGU12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AVG12LH vs TSPC750AMGU12LH |
| MPC750ARX266TX | 32-BIT, 266MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | TSPC750AVG12LH vs MPC750ARX266TX |
| TSXPC750AVGB/Q12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AVG12LH vs TSXPC750AVGB/Q12LH |
| MPC750ARX266LX | 32-BIT, 266MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | TSPC750AVG12LH vs MPC750ARX266LX |
| TSPC750AMGU/T12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AVG12LH vs TSPC750AMGU/T12LH |