Datasheets
TSXPC740AMGB/Q10LE by:

RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360

Part Details for TSXPC740AMGB/Q10LE by e2v technologies

Overview of TSXPC740AMGB/Q10LE by e2v technologies

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Applications Industrial Automation

Part Details for TSXPC740AMGB/Q10LE

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TSXPC740AMGB/Q10LE Part Data Attributes:

TSXPC740AMGB/Q10LE e2v technologies
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TSXPC740AMGB/Q10LE e2v technologies RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360
Part Life Cycle Code Obsolete
Ihs Manufacturer ATMEL GRENOBLE
Part Package Code BGA
Package Description ,
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 83.3 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Speed 233 MHz
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.5 V
Supply Voltage-Nom 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSXPC740AMGB/Q10LE

This table gives cross-reference parts and alternative options found for TSXPC740AMGB/Q10LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC740AMGB/Q10LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSXPC740AMGB/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSXPC740AMGB/Q10LE vs TSXPC740AMGB/T10LE
TSXPC740AVGU/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSXPC740AMGB/Q10LE vs TSXPC740AVGU/T10LE
TSPC740AVGB/Q10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group TSXPC740AMGB/Q10LE vs TSPC740AVGB/Q10LE
TSPC740AMG10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSXPC740AMGB/Q10LE vs TSPC740AMG10LE
MPC740ARX233LX RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Motorola Semiconductor Products TSXPC740AMGB/Q10LE vs MPC740ARX233LX
TSXPC740AMGU10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSXPC740AMGB/Q10LE vs TSXPC740AMGU10LE
TSXPC740AVGB/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSXPC740AMGB/Q10LE vs TSXPC740AVGB/T10LE
TSPC740AMGU10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSXPC740AMGB/Q10LE vs TSPC740AMGU10LE
TSPC740AVG10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group TSXPC740AMGB/Q10LE vs TSPC740AVG10LE
TSPC740AVGU10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSXPC740AMGB/Q10LE vs TSPC740AVGU10LH
Part Number Description Manufacturer Compare
TS(X)PC603PVGU/T6LE 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 e2v technologies TSXPC740AMGB/Q10LE vs TS(X)PC603PVGU/T6LE
WEDMC64603RV200CM RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 Microsemi Corporation TSXPC740AMGB/Q10LE vs WEDMC64603RV200CM
TS(X)PC603RVGU/T6L(C) RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 Thales Group TSXPC740AMGB/Q10LE vs TS(X)PC603RVGU/T6L(C)
TS(X)PC603EVGB/T5MN RISC Microprocessor, 32-Bit, 133MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group TSXPC740AMGB/Q10LE vs TS(X)PC603EVGB/T5MN
TSPC603EMGU2ML RISC Microprocessor, 32-Bit, 80MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSXPC740AMGB/Q10LE vs TSPC603EMGU2ML
TSPC740AVGU/T12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSXPC740AMGB/Q10LE vs TSPC740AVGU/T12LH
TS(X)PC603EVGB/T4ML 32-BIT, 120MHz, RISC PROCESSOR, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSXPC740AMGB/Q10LE vs TS(X)PC603EVGB/T4ML
IBM25EMPPC603E2BB200K RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, 3 MM HEIGHT, CERAMIC, BGA-255 IBM TSXPC740AMGB/Q10LE vs IBM25EMPPC603E2BB200K
MPC603RZT233TX 32-BIT, 233MHz, RISC PROCESSOR, PBGA255, 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 Motorola Mobility LLC TSXPC740AMGB/Q10LE vs MPC603RZT233TX
TS(X)PC603RMGS8L(C) RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, 3.84 MM HEIGHT, CICGA-255 e2v technologies TSXPC740AMGB/Q10LE vs TS(X)PC603RMGS8L(C)

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