Part Details for TSPC603RMGB/Q6LC by e2v technologies
Overview of TSPC603RMGB/Q6LC by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC603RMGB/Q6LC
TSPC603RMGB/Q6LC CAD Models
TSPC603RMGB/Q6LC Part Data Attributes:
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TSPC603RMGB/Q6LC
e2v technologies
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Datasheet
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TSPC603RMGB/Q6LC
e2v technologies
RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | E2V TECHNOLOGIES PLC | |
Part Package Code | BGA | |
Package Description | BGA, BGA255,16X16,50 | |
Pin Count | 255 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 166 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B255 | |
Length | 21 mm | |
Low Power Mode | YES | |
Number of Terminals | 255 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Equivalence Code | BGA255,16X16,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Screening Level | MIL-PRF-38535 Class Q | |
Seated Height-Max | 3 mm | |
Speed | 166 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC603RMGB/Q6LC
This table gives cross-reference parts and alternative options found for TSPC603RMGB/Q6LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC603RMGB/Q6LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TSPC603RMGU6LC | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSPC603RMGB/Q6LC vs TSPC603RMGU6LC |
TSPC603RVGB/Q6LC | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMGB/Q6LC vs TSPC603RVGB/Q6LC |
TSXPC603RMGU6LC | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMGB/Q6LC vs TSXPC603RMGU6LC |
TSPC603RVGU6LC | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSPC603RMGB/Q6LC vs TSPC603RVGU6LC |
TSPC603RMGU6LC | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMGB/Q6LC vs TSPC603RMGU6LC |
TSPC603RVGH6LC | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMGB/Q6LC vs TSPC603RVGH6LC |
TSXPC603RMGB/T6LC | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMGB/Q6LC vs TSXPC603RMGB/T6LC |
TSPC603RVG6LC | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMGB/Q6LC vs TSPC603RVG6LC |
TSPC603RMGB/T6LC | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSPC603RMGB/Q6LC vs TSPC603RMGB/T6LC |
TSPC603RMGB/T6LC | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMGB/Q6LC vs TSPC603RMGB/T6LC |