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Overview of TS(X)PC860MHVZP50C by Teledyne e2v
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for TS(X)PC860MHVZP50C by Teledyne e2v
Part Data Attributes for TS(X)PC860MHVZP50C by Teledyne e2v
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|---|---|
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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ATMEL GRENOBLE
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Part Package Code
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BGA
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Package Description
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PLASTIC, BGA-357
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Pin Count
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357
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Reach Compliance Code
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unknown
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Address Bus Width
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32
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Bit Size
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32
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Boundary Scan
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YES
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Clock Frequency-Max
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50 MHz
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External Data Bus Width
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32
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Format
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FIXED POINT
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Integrated Cache
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YES
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JESD-30 Code
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S-PBGA-B357
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Low Power Mode
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NO
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Number of Terminals
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357
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Operating Temperature-Max
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110 °C
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Operating Temperature-Min
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-40 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Qualification Status
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Not Qualified
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Speed
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50 MHz
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Supply Voltage-Max
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3.465 V
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Supply Voltage-Min
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3.135 V
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Supply Voltage-Nom
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3.3 V
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Surface Mount
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YES
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Temperature Grade
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INDUSTRIAL
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Terminal Form
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BALL
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Terminal Position
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BOTTOM
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uPs/uCs/Peripheral ICs Type
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MICROPROCESSOR, RISC
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Alternate Parts for TS(X)PC860MHVZP50C
This table gives cross-reference parts and alternative options found for TS(X)PC860MHVZP50C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TS(X)PC860MHVZP50C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC855TCVR66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | TS(X)PC860MHVZP50C vs MPC855TCVR66D4 |
| MPC885ZP80 | PowerQUICC, 32 Bit Power Architecture, 80MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | TS(X)PC860MHVZP50C vs MPC885ZP80 |
| XPC857TZP66B | IC,COMMUNICATIONS CONTROLLER,BGA,357PIN | Freescale Semiconductor | TS(X)PC860MHVZP50C vs XPC857TZP66B |
| TSPC860SRVZP66D | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TS(X)PC860MHVZP50C vs TSPC860SRVZP66D |
| TSPC860SRVZPU80D | RISC Microprocessor, 32-Bit, 80MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TS(X)PC860MHVZP50C vs TSPC860SRVZPU80D |
| TS(X)PC860MHVZP50C | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TS(X)PC860MHVZP50C vs TS(X)PC860MHVZP50C |
| TSPC860MHMGU50B | Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHVZP50C vs TSPC860MHMGU50B |
| TS(X)PC860MHVGU40B | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHVZP50C vs TS(X)PC860MHVGU40B |
| TS(X)PC860MHMZPB/Q50C | Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TS(X)PC860MHVZP50C vs TS(X)PC860MHMZPB/Q50C |
| XPC860PCZP66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TS(X)PC860MHVZP50C vs XPC860PCZP66D4 |