Part Details for TMS27PC256-2FME4 by Texas Instruments
Overview of TMS27PC256-2FME4 by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Automotive
Robotics and Drones
Part Details for TMS27PC256-2FME4
TMS27PC256-2FME4 CAD Models
TMS27PC256-2FME4 Part Data Attributes
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TMS27PC256-2FME4
Texas Instruments
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Datasheet
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TMS27PC256-2FME4
Texas Instruments
32KX8 OTPROM, 200ns, PQCC32
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | QCCJ, LDCC32,.5X.6 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 200 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PQCC-J32 | |
Length | 13.97 mm | |
Memory Density | 262144 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC32,.5X.6 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 13 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.56 mm | |
Standby Current-Max | 0.00025 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 11.43 mm |
Alternate Parts for TMS27PC256-2FME4
This table gives cross-reference parts and alternative options found for TMS27PC256-2FME4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS27PC256-2FME4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27256-20JC | OTP ROM, 32KX8, 200ns, NMOS, PQCC32, PLASTIC, LCC-32 | AMD | TMS27PC256-2FME4 vs AM27256-20JC |
TMS27PC256-20FME4 | 32KX8 OTPROM, 200ns, PQCC32 | Texas Instruments | TMS27PC256-2FME4 vs TMS27PC256-20FME4 |
TMS27PC256-2FMLR | 32KX8 OTPROM, 200ns, PQCC32 | Texas Instruments | TMS27PC256-2FME4 vs TMS27PC256-2FMLR |
AT27C256R-20JI | OTP ROM, 32KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 | Atmel Corporation | TMS27PC256-2FME4 vs AT27C256R-20JI |
NM27C256VE200 | OTP ROM, 32KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 | Fairchild Semiconductor Corporation | TMS27PC256-2FME4 vs NM27C256VE200 |
NM27C256V250 | OTP ROM, 32KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 | Fairchild Semiconductor Corporation | TMS27PC256-2FME4 vs NM27C256V250 |
AM27X256-200JI | OTP ROM, 32KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 | Spansion | TMS27PC256-2FME4 vs AM27X256-200JI |
27C256T-20/L | 32K X 8 OTPROM, 200 ns, PQCC32, PLASTIC, LCC-32 | Microchip Technology Inc | TMS27PC256-2FME4 vs 27C256T-20/L |
AT27LV256R-20JIT/R | OTP ROM, 32KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 | Atmel Corporation | TMS27PC256-2FME4 vs AT27LV256R-20JIT/R |
CY27C256-200JCR | OTP ROM, 32KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | TMS27PC256-2FME4 vs CY27C256-200JCR |