Memory
TC5563APL-10
Toshiba America Electronic Components
Description: IC 8K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.300 INCH, SLIM, PLASTIC, DIP-28, Static RAM

Overview of TC5563APL-10 by Toshiba America Electronic Components

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Part Data Attributes for TC5563APL-10 by Toshiba America Electronic Components

TC5563APL-10
Toshiba America Electronic Components
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Active
Ihs Manufacturer
TOSHIBA CORP
Part Package Code
DIP
Package Description
DIP, DIP28,.3
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
100 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T28
JESD-609 Code
e0
Length
34.9 mm
Memory Density
65536 bit
Memory IC Type
STANDARD SRAM
Memory Width
8
Number of Functions
1
Number of Ports
1
Number of Terminals
28
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
8KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
4.45 mm
Standby Current-Max
0.0001 A
Standby Voltage-Min
2 V
Supply Current-Max
0.045 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Want to compare parts?
  1. TC5563APL-10
    Toshiba America Electronic Components
    IC 8K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.300 INCH, SLIM, PLASTIC, DIP-28, Static RAM
    VS

Alternate Parts for TC5563APL-10

This table gives cross-reference parts and alternative options found for TC5563APL-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC5563APL-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
MB8464A-10-P 8KX8 STANDARD SRAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 FUJITSU Limited TC5563APL-10 vs MB8464A-10-P
HY6264ALP-10I Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 SK Hynix Inc TC5563APL-10 vs HY6264ALP-10I
MS6265-10NC Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Mosel Vitelic Corporation TC5563APL-10 vs MS6265-10NC
MS6264CLL-10PC Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Mosel Vitelic Corporation TC5563APL-10 vs MS6264CLL-10PC
MS6264NL-10PC Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Mosel Vitelic Corporation TC5563APL-10 vs MS6264NL-10PC
U6264ADG10 Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 ZMDI TC5563APL-10 vs U6264ADG10
SRM2264LC10 Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Seiko Epson Corporation TC5563APL-10 vs SRM2264LC10
MB8464A-10LLP Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 FUJITSU Semiconductor Limited TC5563APL-10 vs MB8464A-10LLP
U6264ADC10LL Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 ZMDI TC5563APL-10 vs U6264ADC10LL
CXK5864BSP-10LL Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, MO-058AB, DIP-28 Sony Semiconductor TC5563APL-10 vs CXK5864BSP-10LL
Part Number Description Manufacturer Compare
AT68166FT-YS18-E Standard SRAM, 512KX32, 18ns, CMOS, CQFP68 Microchip Technology Inc TC5563APL-10 vs AT68166FT-YS18-E
HMU-65798M-9 Standard SRAM, 64KX4, 45ns, CMOS, PDSO24 Matra MHS TC5563APL-10 vs HMU-65798M-9
WS128K32L-15G2UQA SRAM Module, 128KX32, 15ns, CMOS, CQFP68, 22.36 X 22.36 MM, CERAMIC, QFP-68 White Electronic Designs Corp TC5563APL-10 vs WS128K32L-15G2UQA
WS128K32-55HSM SRAM Module, 512KX8, 55ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp TC5563APL-10 vs WS128K32-55HSM
IDT7188S20Y Standard SRAM, 16KX4, 20ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 Integrated Device Technology Inc TC5563APL-10 vs IDT7188S20Y
WS512K32-25G2TIA SRAM Module, 512KX32, 25ns, CMOS, CQMA68, CERAMIC, QFP-68 Mercury Systems Inc TC5563APL-10 vs WS512K32-25G2TIA
WS512K32L-20G2LMA SRAM Module, 512KX32, 20ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp TC5563APL-10 vs WS512K32L-20G2LMA
L7C192CM45 Standard SRAM, 64KX4, 45ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 LOGIC Devices Inc TC5563APL-10 vs L7C192CM45
L7C199MM15 Standard SRAM, 32KX8, 15ns, CMOS, CDFP28, CERFLAT-28 LOGIC Devices Inc TC5563APL-10 vs L7C199MM15
HM3-65799F-5:D Standard SRAM, 64KX4, 20ns, CMOS, PDIP28 Matra MHS TC5563APL-10 vs HM3-65799F-5:D

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