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Overview of TC5563APL-10 by Toshiba America Electronic Components
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for TC5563APL-10 by Toshiba America Electronic Components
Part Data Attributes for TC5563APL-10 by Toshiba America Electronic Components
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
TOSHIBA CORP
|
Part Package Code
|
DIP
|
Package Description
|
DIP, DIP28,.3
|
Pin Count
|
28
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
100 ns
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PDIP-T28
|
JESD-609 Code
|
e0
|
Length
|
34.9 mm
|
Memory Density
|
65536 bit
|
Memory IC Type
|
STANDARD SRAM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Ports
|
1
|
Number of Terminals
|
28
|
Number of Words
|
8192 words
|
Number of Words Code
|
8000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
8KX8
|
Output Characteristics
|
3-STATE
|
Output Enable
|
YES
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP28,.3
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
4.45 mm
|
Standby Current-Max
|
0.0001 A
|
Standby Voltage-Min
|
2 V
|
Supply Current-Max
|
0.045 mA
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Width
|
7.62 mm
|
Alternate Parts for TC5563APL-10
This table gives cross-reference parts and alternative options found for TC5563APL-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC5563APL-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MB8464A-10-P | 8KX8 STANDARD SRAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | FUJITSU Limited | TC5563APL-10 vs MB8464A-10-P |
HY6264ALP-10I | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | SK Hynix Inc | TC5563APL-10 vs HY6264ALP-10I |
MS6265-10NC | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Mosel Vitelic Corporation | TC5563APL-10 vs MS6265-10NC |
MS6264CLL-10PC | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Mosel Vitelic Corporation | TC5563APL-10 vs MS6264CLL-10PC |
MS6264NL-10PC | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Mosel Vitelic Corporation | TC5563APL-10 vs MS6264NL-10PC |
U6264ADG10 | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | ZMDI | TC5563APL-10 vs U6264ADG10 |
SRM2264LC10 | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Seiko Epson Corporation | TC5563APL-10 vs SRM2264LC10 |
MB8464A-10LLP | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | FUJITSU Semiconductor Limited | TC5563APL-10 vs MB8464A-10LLP |
U6264ADC10LL | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | ZMDI | TC5563APL-10 vs U6264ADC10LL |
CXK5864BSP-10LL | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, MO-058AB, DIP-28 | Sony Semiconductor | TC5563APL-10 vs CXK5864BSP-10LL |