There are no models available for this part yet.
Overview of S63364M-P by Gould Ami
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
CAD Models for S63364M-P by Gould Ami
Part Data Attributes for S63364M-P by Gould Ami
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|
|---|---|
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Part Life Cycle Code
|
Obsolete
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|
Ihs Manufacturer
|
GOULD AMI
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|
Package Description
|
,
|
|
Reach Compliance Code
|
unknown
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ECCN Code
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EAR99
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HTS Code
|
8542.32.00.71
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Access Time-Max
|
350 ns
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JESD-30 Code
|
R-PDIP-T24
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Memory Density
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16384 bit
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Memory IC Type
|
MASK ROM
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Memory Width
|
8
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Number of Functions
|
1
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Number of Terminals
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24
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Number of Words
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8192 words
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Number of Words Code
|
8000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Organization
|
2KX8
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Package Body Material
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PLASTIC/EPOXY
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
|
PARALLEL
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Qualification Status
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Not Qualified
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Supply Current-Max
|
0.1 mA
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Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
NO
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Technology
|
CMOS
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Temperature Grade
|
MILITARY
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Terminal Form
|
THROUGH-HOLE
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Terminal Position
|
DUAL
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Alternate Parts for S63364M-P
This table gives cross-reference parts and alternative options found for S63364M-P. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S63364M-P, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AT27HC642R-70DM | UVPROM, 8KX8, 70ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | Atmel Corporation | S63364M-P vs AT27HC642R-70DM |
| 5962-8751503JA | 8KX8 UVPROM, 70ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 | STMicroelectronics | S63364M-P vs 5962-8751503JA |
| 27HC641L-55/J | 8K X 8 UVPROM, 55 ns, CDIP24, WINDOWED, CERDIP-24 | Microchip Technology Inc | S63364M-P vs 27HC641L-55/J |
| WS57C49B-55T | UVPROM, 8KX8, 55ns, CMOS, CDIP24, | Waferscale Integration Inc | S63364M-P vs WS57C49B-55T |
| M27HC641-35XFS1 | 8KX8 UVPROM, 35ns, CDIP24, 0.300 INCH, FRIT SEALED, WINDOWED, CERAMIC, DIP-24 | STMicroelectronics | S63364M-P vs M27HC641-35XFS1 |
| 27HC641-70/J | 8K X 8 UVPROM, 70 ns, CDIP24, WINDOWED, CERDIP-24 | Microchip Technology Inc | S63364M-P vs 27HC641-70/J |
| AT27HC641R-70DM | UVPROM, 8KX8, 70ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 | Atmel Corporation | S63364M-P vs AT27HC641R-70DM |
| F356435S | MASK ROM, 8KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24 | Fairchild Semiconductor Corporation | S63364M-P vs F356435S |
| HI1264B-D-000 | MASK ROM, 8KX8, 35ns, CMOS, CDIP24 | Hughes Aircraft | S63364M-P vs HI1264B-D-000 |
| AT27HC641R-45LC | UVPROM, 8KX8, 45ns, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28 | Atmel Corporation | S63364M-P vs AT27HC641R-45LC |