Datasheets
RP532010E by: Ricoh Electronic Devices Co Ltd

MASK ROM, 256KX8, 200ns, CMOS, PDIP32, DIP-32

Part Details for RP532010E by Ricoh Electronic Devices Co Ltd

Overview of RP532010E by Ricoh Electronic Devices Co Ltd

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Part Details for RP532010E

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RP532010E Part Data Attributes

RP532010E Ricoh Electronic Devices Co Ltd
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RP532010E Ricoh Electronic Devices Co Ltd MASK ROM, 256KX8, 200ns, CMOS, PDIP32, DIP-32
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer RICOH ELECTRONIC DEVICES CO LTD
Part Package Code DIP
Package Description DIP,
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 250 ns
Additional Feature POWER-DOWN
JESD-30 Code R-PDIP-T32
Memory Density 1048576 bit
Memory IC Type MASK ROM
Memory Width 8
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 32
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for RP532010E

This table gives cross-reference parts and alternative options found for RP532010E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of RP532010E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MS312002-20PC MASK ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 Mosel Vitelic Corporation RP532010E vs MS312002-20PC
KM23C2000-20 MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor RP532010E vs KM23C2000-20
S632000C-C MASK ROM, 256KX8, 200ns, CMOS, CDIP32 Gould Ami RP532010E vs S632000C-C
HN62302BP-20 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 Renesas Electronics Corporation RP532010E vs HN62302BP-20
MX23C2000PC-20 MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd RP532010E vs MX23C2000PC-20
MB832000-20M 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 FUJITSU Limited RP532010E vs MB832000-20M
MB832000-20P 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 FUJITSU Limited RP532010E vs MB832000-20P
HM23C2002AP-20 MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hualon Microelectronics Corp RP532010E vs HM23C2002AP-20
Part Number Description Manufacturer Compare
S632000I-C MASK ROM, 256KX8, 200ns, CMOS, CDIP32 Gould Ami RP532010E vs S632000I-C
MB832000-20M 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 FUJITSU Limited RP532010E vs MB832000-20M
S632000C-C MASK ROM, 256KX8, 200ns, CMOS, CDIP32 Gould Ami RP532010E vs S632000C-C
MB832000-20P 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 FUJITSU Limited RP532010E vs MB832000-20P
MX23C2000PC-20 MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd RP532010E vs MX23C2000PC-20
HM23C2002AP-20 MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hualon Microelectronics Corp RP532010E vs HM23C2002AP-20
KM23C2000-20 MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor RP532010E vs KM23C2000-20

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