Datasheets
QP27C256-70/ZA by: Teledyne e2v

UVPROM, 32KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32

Part Details for QP27C256-70/ZA by Teledyne e2v

Overview of QP27C256-70/ZA by Teledyne e2v

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Price & Stock for QP27C256-70/ZA

Part # Distributor Description Stock Price Buy
DISTI # QP27C256-70/ZA
Avnet Americas PROM, UV ERASABLE, 32K X 8, 70 NS ACCESS - Trays (Alt: QP27C256-70/ZA) Min Qty: 250 Package Multiple: 1 Container: Tray 0
RFQ
DISTI # QP27C256-70/ZA
Avnet Americas PROM, UV ERASABLE, 32K X 8, 70 NS ACCESS - Trays (Alt: QP27C256-70/ZA) Min Qty: 250 Package Multiple: 1 Container: Tray 0
RFQ

Part Details for QP27C256-70/ZA

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QP27C256-70/ZA Part Data Attributes

QP27C256-70/ZA Teledyne e2v
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QP27C256-70/ZA Teledyne e2v UVPROM, 32KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32
Part Life Cycle Code Active
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Part Package Code QFJ
Package Description CERAMIC, LCC-32
Pin Count 32
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 70 ns
JESD-30 Code R-CQCC-N32
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QCCN
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form NO LEAD
Terminal Position QUAD

Alternate Parts for QP27C256-70/ZA

This table gives cross-reference parts and alternative options found for QP27C256-70/ZA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QP27C256-70/ZA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8606308YC UVPROM, 32KX8, 70ns, CMOS, CQCC32 QP Semiconductor QP27C256-70/ZA vs 5962-8606308YC
5962-8606318YX UVPROM, 32KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32 QP Semiconductor QP27C256-70/ZA vs 5962-8606318YX
FT27C256R-70LM/883 UVPROM, 32KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Force Technologies Ltd QP27C256-70/ZA vs FT27C256R-70LM/883
5962-8606308YA UVPROM, 32KX8, 70ns, CMOS, CQCC32, Waferscale Integration Inc QP27C256-70/ZA vs 5962-8606308YA
5662-860639UA UVPROM, 32KX8, 70ns, CMOS, JLCC-32 Teledyne e2v QP27C256-70/ZA vs 5662-860639UA
AS27C256A-70ECAM/MIL Memory IC Micross Components QP27C256-70/ZA vs AS27C256A-70ECAM/MIL
QP27C256-55/UA UVPROM, 32KX8, 70ns, CMOS, JLCC-32 Teledyne e2v QP27C256-70/ZA vs QP27C256-55/UA
5962-8606308YX UVPROM, 32KX8, 70ns, CMOS, CQCC32, Micross Components QP27C256-70/ZA vs 5962-8606308YX
AT27HC256R-70LM/883 UVPROM, 32KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32 Atmel Corporation QP27C256-70/ZA vs AT27HC256R-70LM/883
5962-8606308YX UVPROM, 32KX8, 70ns, CMOS, CQCC32 Atmel Corporation QP27C256-70/ZA vs 5962-8606308YX
Part Number Description Manufacturer Compare
5962-8606308YA UVPROM, 32KX8, 70ns, CMOS, CQCC32, Waferscale Integration Inc QP27C256-70/ZA vs 5962-8606308YA
WS57C256F-70CMB UVPROM, 32KX8, 70ns, CMOS, CQCC32, CERAMIC, LLCC-32 Teledyne e2v QP27C256-70/ZA vs WS57C256F-70CMB
AS27C256-70ECAM UVPROM, 32KX8, 70ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 Micross Components QP27C256-70/ZA vs AS27C256-70ECAM
5662-860639UA UVPROM, 32KX8, 70ns, CMOS, JLCC-32 Teledyne e2v QP27C256-70/ZA vs 5662-860639UA
QP27C256-55/QXA UVPROM, 32KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32 Teledyne e2v QP27C256-70/ZA vs QP27C256-55/QXA
AM27H256-70LEB UVPROM, 32KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32 AMD QP27C256-70/ZA vs AM27H256-70LEB
AM27C256-70/BUA UVPROM, 32KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD QP27C256-70/ZA vs AM27C256-70/BUA
5662-860638YC UVPROM, 32KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32 Teledyne e2v QP27C256-70/ZA vs 5662-860638YC
QP27C256-55/UA UVPROM, 32KX8, 70ns, CMOS, JLCC-32 Teledyne e2v QP27C256-70/ZA vs QP27C256-55/UA
5962-8606308YX UVPROM, 32KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LLCC-32 Waferscale Integration Inc QP27C256-70/ZA vs 5962-8606308YX

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