Part Details for QD2764 by Intel Corporation
Overview of QD2764 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
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Aerospace and Defense
Healthcare
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Part Details for QD2764
QD2764 CAD Models
QD2764 Part Data Attributes
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QD2764
Intel Corporation
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Datasheet
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QD2764
Intel Corporation
UVPROM, 8KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.084 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 21 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for QD2764
This table gives cross-reference parts and alternative options found for QD2764. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QD2764, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TS27C64A-25CQ | 8KX8 UVPROM, 250ns, CDIP28, CERAMIC, FDIP-28 | STMicroelectronics | QD2764 vs TS27C64A-25CQ |
| AM27C64-255DC | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD2764 vs AM27C64-255DC |
| AM27C64-250DIB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD2764 vs AM27C64-250DIB |
| 27C64MQB/B25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | QD2764 vs 27C64MQB/B25 |
| AM2764ADC | UVPROM, 8KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | QD2764 vs AM2764ADC |
| AM27C64-250DE | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD2764 vs AM27C64-250DE |
| MBM27C64-25Z | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | FUJITSU Semiconductor Limited | QD2764 vs MBM27C64-25Z |
| TMS27C64JL | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | QD2764 vs TMS27C64JL |
| AM27C64-255DIB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Spansion | QD2764 vs AM27C64-255DIB |
| AM27C64-250/BXA | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD2764 vs AM27C64-250/BXA |