Part Details for PC755CMGSU400LE by Atmel Corporation
Overview of PC755CMGSU400LE by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PC755CMGSU400LE
PC755CMGSU400LE CAD Models
PC755CMGSU400LE Part Data Attributes
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PC755CMGSU400LE
Atmel Corporation
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Datasheet
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PC755CMGSU400LE
Atmel Corporation
RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ATMEL CORP | |
Part Package Code | CGA | |
Package Description | BGA, CGA360,19X19,50 | |
Pin Count | 360 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 100 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B360 | |
Length | 25 mm | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Equivalence Code | CGA360,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.08 mm | |
Speed | 400 MHz | |
Supply Voltage-Max | 2.1 V | |
Supply Voltage-Min | 1.8 V | |
Supply Voltage-Nom | 2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC755CMGSU400LE
This table gives cross-reference parts and alternative options found for PC755CMGSU400LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755CMGSU400LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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XPC755BRX400LB | 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | PC755CMGSU400LE vs XPC755BRX400LB |
PC755CMGU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, BGA-360 | Teledyne e2v | PC755CMGSU400LE vs PC755CMGU400LE |
PC755CMGU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Atmel Corporation | PC755CMGSU400LE vs PC755CMGU400LE |
PC755CVGHU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, BGA-360 | Teledyne e2v | PC755CMGSU400LE vs PC755CVGHU400LE |
PCX755CMZFU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 | Atmel Corporation | PC755CMGSU400LE vs PCX755CMZFU400LE |
PCX755CVGHU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 | Teledyne e2v | PC755CMGSU400LE vs PCX755CVGHU400LE |
PCX755CVGU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | PC755CMGSU400LE vs PCX755CVGU400LE |
PC755CVG400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, BGA-360 | Teledyne e2v | PC755CMGSU400LE vs PC755CVG400LE |
PC755CVGSU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 | Teledyne e2v | PC755CMGSU400LE vs PC755CVGSU400LE |
PCX755CVGS400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 | Teledyne e2v | PC755CMGSU400LE vs PCX755CVGS400LE |