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Microcontrollers and Processors / Microprocessors / PC7410VGS500NE
Datasheets
PC7410VGS500NE by:

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

Part Details for PC7410VGS500NE by Teledyne e2v

Overview of PC7410VGS500NE by Teledyne e2v

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Part Details for PC7410VGS500NE

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PC7410VGS500NE Part Data Attributes

Parametric Data
PC7410VGS500NE Teledyne e2v
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PC7410VGS500NE Teledyne e2v RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360
Part Life Cycle Code Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC
Part Package Code BGA
Package Description BGA, CGA360,19X19,50
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 133 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Equivalence Code CGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.2 mm
Speed 500 MHz
Supply Voltage-Max 1.55 V
Supply Voltage-Min 1.45 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC7410VGS500NE

This table gives cross-reference parts and alternative options found for PC7410VGS500NE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC7410VGS500NE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC7410VGU500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC7410VGS500NE vs PC7410VGU500NE
PC7410MGS500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PC7410MGS500NE
PC7410MG500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC7410VGS500NE vs PC7410MG500NE
PC7410MGU500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PC7410MGU500NE
PC7410MGS500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation PC7410VGS500NE vs PC7410MGS500NE
PC7410MGSU500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PC7410MGSU500NE
PC7410VGSU500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PC7410VGSU500NE
PC7410VGS500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation PC7410VGS500NE vs PC7410VGS500NE
PC7410VGSU500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation PC7410VGS500NE vs PC7410VGSU500NE
PC7410VG500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC7410VGS500NE vs PC7410VG500NE
Part Number Description Manufacturer Compare
PC7410VGSU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PC7410VGSU500LE
MPC7410RX500LX 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PC7410VGS500NE vs MPC7410RX500LX
PC7410MG500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PC7410MG500LE
PC7410VGHU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PC7410VGHU500LE
MPC7410THX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors PC7410VGS500NE vs MPC7410THX500LE
PC7410MGSU500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PC7410MGSU500NE
PC7410VG500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PC7410VG500NE
PCX7410VGSU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PCX7410VGSU500LE
MC7410VU500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors PC7410VGS500NE vs MC7410VU500LE
PCX7410VGU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC7410VGS500NE vs PCX7410VGU500LE

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