There are no models available for this part yet.
Overview of PC8641DVSH1333HC by Teledyne e2v
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for PC8641DVSH1333HC by Teledyne e2v
Part Data Attributes for PC8641DVSH1333HC by Teledyne e2v
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|---|---|
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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TELEDYNE E2V (UK) LTD
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Part Package Code
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BGA
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Package Description
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BGA,
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Pin Count
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1023
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Reach Compliance Code
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compliant
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ECCN Code
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3A991.A.2
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HTS Code
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8542.31.00.01
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Address Bus Width
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Bit Size
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32
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Boundary Scan
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YES
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Clock Frequency-Max
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166.66 MHz
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External Data Bus Width
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Format
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FLOATING POINT
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Integrated Cache
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YES
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JESD-30 Code
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S-CBGA-B1023
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JESD-609 Code
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e1
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Length
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33 mm
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Low Power Mode
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YES
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Number of Terminals
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1023
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Code
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BGA
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Seated Height-Max
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2.77 mm
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Speed
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1333 MHz
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Supply Voltage-Max
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1.15 V
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Supply Voltage-Min
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1.05 V
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Supply Voltage-Nom
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1.1 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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MILITARY
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Terminal Finish
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TIN SILVER COPPER
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Width
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33 mm
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uPs/uCs/Peripheral ICs Type
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MICROPROCESSOR
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Alternate Parts for PC8641DVSH1333HC
This table gives cross-reference parts and alternative options found for PC8641DVSH1333HC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC8641DVSH1333HC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| PC8641DVGH1500KE | Microprocessor, CMOS, CBGA1023, 33 X 33 MM, 2.97 MM HEIGHT, 1 MM PITCH, CERAMIC, FC-BGA-1023 | Teledyne e2v | PC8641DVSH1333HC vs PC8641DVGH1500KE |
| PC8640FGH1067NE | Microprocessor, 32-Bit, 533MHz, CMOS, CBGA1023, 33 X 33 MM, 1 MM PITCH, CERAMIC, FCBGA-1023 | Teledyne e2v | PC8641DVSH1333HC vs PC8640FGH1067NE |
| PC8641DMGH1250GB | Microprocessor, 32-Bit, 1250MHz, CMOS, CBGA1023, 33 X 33 MM, 2.97 MM HEIGHT, 1 MM PITCH, CERAMIC, BGA-1023 | Teledyne e2v | PC8641DVSH1333HC vs PC8641DMGH1250GB |
| PC8641MGH1250KC | Microprocessor, 32-Bit, 1250MHz, CMOS, CBGA1023, 33 X 33 MM, 2.97 MM HEIGHT, 1 MM PITCH, CERAMIC, BGA-1023 | Teledyne e2v | PC8641DVSH1333HC vs PC8641MGH1250KC |
| MPC8568EVTAUJJA | 32-BIT, 1333MHz, RISC PROCESSOR, PBGA1023 | NXP Semiconductors | PC8641DVSH1333HC vs MPC8568EVTAUJJA |
| MC8641DVU1500HB | MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 | Freescale Semiconductor | PC8641DVSH1333HC vs MC8641DVU1500HB |
| PC8641MGH1333GB | Microprocessor, 32-Bit, 1333MHz, CMOS, CBGA1023, 33 X 33 MM, 2.97 MM HEIGHT, 1 MM PITCH, CERAMIC, BGA-1023 | Teledyne e2v | PC8641DVSH1333HC vs PC8641MGH1333GB |
| MC8641HX1250KC | MICROPROCESSOR, CBGA1023, 33 X 33 MM, CERAMIC, BGA-1023 | Freescale Semiconductor | PC8641DVSH1333HC vs MC8641HX1250KC |
| PC8641DVSH1333NB | Microprocessor, 32-Bit, 1333MHz, CMOS, CBGA1023, 33 X 33 MM, 2.72 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-1023 | Teledyne e2v | PC8641DVSH1333HC vs PC8641DVSH1333NB |
| MC8641HX1333HB | MICROPROCESSOR, CBGA1023, 33 X 33 MM, CERAMIC, BGA-1023 | Freescale Semiconductor | PC8641DVSH1333HC vs MC8641HX1333HB |