Part Details for PC755BMGSU300LE by Atmel Corporation
Overview of PC755BMGSU300LE by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PC755BMGSU300LE
PC755BMGSU300LE CAD Models
PC755BMGSU300LE Part Data Attributes
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PC755BMGSU300LE
Atmel Corporation
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Datasheet
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PC755BMGSU300LE
Atmel Corporation
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | CGA | |
| Package Description | BGA, BGA360,19X19,50 | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Equivalence Code | BGA360,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.08 mm | |
| Speed | 300 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC755BMGSU300LE
This table gives cross-reference parts and alternative options found for PC755BMGSU300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BMGSU300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| PCX755BMGS300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CI-CGA-360 | e2v technologies | PC755BMGSU300LE vs PCX755BMGS300LE |
| PC755BVG300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360 | e2v technologies | PC755BMGSU300LE vs PC755BVG300LE |
| PC755BVGSU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | PC755BMGSU300LE vs PC755BVGSU300LE |
| XPC755BRX300LB | 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | PC755BMGSU300LE vs XPC755BRX300LB |
| XPC755BPX300LB | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 | Motorola Semiconductor Products | PC755BMGSU300LE vs XPC755BPX300LB |
| XPC755BRX300LB | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Semiconductor Products | PC755BMGSU300LE vs XPC755BRX300LB |
| PCX755BMGHU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 | e2v technologies | PC755BMGSU300LE vs PCX755BMGHU300LE |
| PC755BMGH300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | PC755BMGSU300LE vs PC755BMGH300LE |
| PC755BVGU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Atmel Corporation | PC755BMGSU300LE vs PC755BVGU300LE |
| PC755BVGHU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360 | e2v technologies | PC755BMGSU300LE vs PC755BVGHU300LE |