Part Details for PC755BVG300LE by e2v technologies
Overview of PC755BVG300LE by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Industrial Automation
Telecommunications
Electronic Manufacturing
Part Details for PC755BVG300LE
PC755BVG300LE CAD Models
PC755BVG300LE Part Data Attributes:
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PC755BVG300LE
e2v technologies
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Datasheet
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PC755BVG300LE
e2v technologies
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | E2V TECHNOLOGIES PLC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA360,19X19,50 | |
| Pin Count | 360 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Equivalence Code | BGA360,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.2 mm | |
| Speed | 300 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC755BVG300LE
This table gives cross-reference parts and alternative options found for PC755BVG300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BVG300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| PC755BMGH300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | PC755BVG300LE vs PC755BMGH300LE |
| PCX755BMGSU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CI-CGA-360 | e2v technologies | PC755BVG300LE vs PCX755BMGSU300LE |
| PC755BMGSU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CI-CGA-360 | e2v technologies | PC755BVG300LE vs PC755BMGSU300LE |
| PCX755BVGH300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 | e2v technologies | PC755BVG300LE vs PCX755BVGH300LE |
| PC755BVGSU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | PC755BVG300LE vs PC755BVGSU300LE |
| PC755BMG300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360 | e2v technologies | PC755BVG300LE vs PC755BMG300LE |
| PCX755BMGU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360 | e2v technologies | PC755BVG300LE vs PCX755BMGU300LE |
| PC755BMGH300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360 | e2v technologies | PC755BVG300LE vs PC755BMGH300LE |
| XPC755BRX300LB | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Semiconductor Products | PC755BVG300LE vs XPC755BRX300LB |
| XPC755BRX300LB | 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | PC755BVG300LE vs XPC755BRX300LB |