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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: PC755BMGSU300LE under Microprocessors

Select parts from the table below to compare.

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Select Parts		Part Number

		PC755BMGSU300LE Atmel Corporation
		PC755BMGSU300LE Teledyne e2v

			Most Relevant							Technical										Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

No

Transferred

32

300 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

YES

2.1 V

1.8 V

MILITARY

S-CBGA-B360

Not Qualified

e0

125 °C

-55 °C

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

4.08 mm

25 mm

25 mm

ATMEL CORP

CGA

BGA, BGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

Check for Price

No

Obsolete

32

300 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

YES

2.1 V

1.8 V

MILITARY

S-CBGA-B360

Not Qualified

125 °C

-55 °C

360

CERAMIC, METAL-SEALED COFIRED

BGA

CGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

4.08 mm

25 mm

25 mm

E2V TECHNOLOGIES PLC

CGA

BGA, CGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

Compare

Microcontrollers and Processors

PC755BMGSU300LE

Atmel Corporation

Check for Price

No

Transferred

32

300 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

YES

2.1 V

1.8 V

MILITARY

S-CBGA-B360

Not Qualified

e0

125 °C

-55 °C

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

4.08 mm

25 mm

25 mm

ATMEL CORP

CGA

BGA, BGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

Microcontrollers and Processors

PC755BMGSU300LE

Teledyne e2v

Check for Price

No

Obsolete

32

300 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

YES

2.1 V

1.8 V

MILITARY

S-CBGA-B360

Not Qualified

125 °C

-55 °C

360

CERAMIC, METAL-SEALED COFIRED

BGA

CGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

4.08 mm

25 mm

25 mm

E2V TECHNOLOGIES PLC

CGA

BGA, CGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01