There are no models available for this part yet.
Overview of N82S191CN3 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Consumer Electronics
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
CAD Models for N82S191CN3 by NXP Semiconductors
Part Data Attributes for N82S191CN3 by NXP Semiconductors
|
|
|
|---|---|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Package Description
|
DIP, DIP24,.3
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.71
|
|
Access Time-Max
|
35 ns
|
|
JESD-30 Code
|
R-PDIP-T24
|
|
JESD-609 Code
|
e0
|
|
Memory Density
|
16384 bit
|
|
Memory IC Type
|
OTP ROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
24
|
|
Number of Words
|
2048 words
|
|
Number of Words Code
|
2000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
75 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
2KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP24,.3
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Supply Current-Max
|
0.175 mA
|
|
Supply Voltage-Max (Vsup)
|
5.25 V
|
|
Supply Voltage-Min (Vsup)
|
4.75 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
BIPOLAR
|
|
Temperature Grade
|
COMMERCIAL EXTENDED
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
Alternate Parts for N82S191CN3
This table gives cross-reference parts and alternative options found for N82S191CN3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of N82S191CN3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 63S1681AN | OTP ROM, 2KX8, 35ns, CMOS, PDIP24, | Monolithic Memories (RETIRED) | N82S191CN3 vs 63S1681AN |
| CY7C293A-35PI | OTP ROM, 2KX8, 35ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | Cypress Semiconductor | N82S191CN3 vs CY7C293A-35PI |
| 63S1681ANSXXXX | OTP ROM, 2KX8, 35ns, CMOS, PDIP24, | Monolithic Memories (RETIRED) | N82S191CN3 vs 63S1681ANSXXXX |
| 63S1681ANXXXX | OTP ROM, 2KX8, 35ns, CMOS, PDIP24, | Monolithic Memories (RETIRED) | N82S191CN3 vs 63S1681ANXXXX |
| CY7C293AL-35PI | OTP ROM, 2KX8, 35ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | Cypress Semiconductor | N82S191CN3 vs CY7C293AL-35PI |
| CY7C292AL-35PI | OTP ROM, 2KX8, 35ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | Cypress Semiconductor | N82S191CN3 vs CY7C292AL-35PI |
| QP7C291A-35DMB | OTP ROM, 2KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 | Teledyne e2v | N82S191CN3 vs QP7C291A-35DMB |
| CY7C292-35DC | OTP ROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 | Cypress Semiconductor | N82S191CN3 vs CY7C292-35DC |
| AM27S291ADCB | OTP ROM, 2KX8, 35ns, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | AMD | N82S191CN3 vs AM27S291ADCB |
| AM27S291APCB | OTP ROM, 2KX8, 35ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | AMD | N82S191CN3 vs AM27S291APCB |