N82S191CN3 vs PY291A-35PMB feature comparison

N82S191CN3 NXP Semiconductors

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PY291A-35PMB Pyramid Semiconductor Corporation

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS PYRAMID SEMICONDUCTOR CORP
Package Description DIP, DIP24,.3 DIP,
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
JESD-30 Code R-PDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Memory Density 16384 bit 8192 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8 1KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.175 mA 0.09 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 24
Length 31.877 mm
Screening Level MIL-STD-883
Seated Height-Max 5.33 mm
Width 7.62 mm

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Compare PY291A-35PMB with alternatives