Datasheets
AM27S25/B3C by:

OTP ROM, 512X8, 30ns, Bipolar, CQCC28, CERAMIC, LCC-28

Part Details for AM27S25/B3C by AMD

Overview of AM27S25/B3C by AMD

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Applications Computing and Data Storage

Available Datasheets

Part # Manufacturer Description Datasheet
AM27S25DM Rochester Electronics LLC OTP ROM

Part Details for AM27S25/B3C

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AM27S25/B3C Part Data Attributes

AM27S25/B3C AMD
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AM27S25/B3C AMD OTP ROM, 512X8, 30ns, Bipolar, CQCC28, CERAMIC, LCC-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code QLCC
Package Description QCCN, LCC28,.45SQ
Pin Count 28
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 50 ns
JESD-30 Code S-CQCC-N28
JESD-609 Code e0
Length 11.43 mm
Memory Density 16384 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 512 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QCCN
Package Equivalence Code LCC28,.45SQ
Package Shape SQUARE
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 1.905 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 11.43 mm

Alternate Parts for AM27S25/B3C

This table gives cross-reference parts and alternative options found for AM27S25/B3C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S25/B3C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-88518043X OTP ROM, 512X8, CMOS, CQCC28, Teledyne e2v AM27S25/B3C vs 5962-88518043X
5962-88518073A OTP ROM, 512X8, 25ns, CMOS, CQCC28, Teledyne e2v AM27S25/B3C vs 5962-88518073A
5962-88518073X OTP ROM, 512X8, CMOS, CQCC28, Teledyne e2v AM27S25/B3C vs 5962-88518073X
AM27S25A/B3A OTP ROM, 512X8, Bipolar, CQCC28, CERAMIC, LCC-28 Rochester Electronics LLC AM27S25/B3C vs AM27S25A/B3A
Part Number Description Manufacturer Compare
6341-1L OTP ROM, 512X8, 70ns, CMOS, MQCC28, Monolithic Memories (RETIRED) AM27S25/B3C vs 6341-1L
AM27S25PC OTP ROM, 512X8, 27ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 AMD AM27S25/B3C vs AM27S25PC
5340-1JS OTP ROM, 512X8, 80ns, CMOS, CDIP24, Monolithic Memories (RETIRED) AM27S25/B3C vs 5340-1JS
53RA481JS OTP ROM, 512X8, 35ns, CMOS, CDIP24, Monolithic Memories (RETIRED) AM27S25/B3C vs 53RA481JS
7801601JX OTP ROM, 512X8, 90ns, CMOS, CDIP24, CERAMIC, DIP-24 Lansdale Semiconductor Inc AM27S25/B3C vs 7801601JX
AM27S25APCB OTP ROM, 512X8, 20ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 AMD AM27S25/B3C vs AM27S25APCB
5962-8851801LA OTP ROM, 512X8, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor AM27S25/B3C vs 5962-8851801LA
5962-8851806LX OTP ROM, 512X8, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor AM27S25/B3C vs 5962-8851806LX
6341-1NXXXX OTP ROM, 512X8, 70ns, CMOS, PDIP24, Monolithic Memories (RETIRED) AM27S25/B3C vs 6341-1NXXXX
5962-8869002JA OTP ROM, 512X8, 140ns, CMOS, CDIP24, Harris Semiconductor AM27S25/B3C vs 5962-8869002JA

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