Part Details for AM27S25/B3C by AMD
Overview of AM27S25/B3C by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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AM27S25DM | Rochester Electronics LLC | OTP ROM |
Part Details for AM27S25/B3C
AM27S25/B3C CAD Models
AM27S25/B3C Part Data Attributes
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AM27S25/B3C
AMD
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Datasheet
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AM27S25/B3C
AMD
OTP ROM, 512X8, 30ns, Bipolar, CQCC28, CERAMIC, LCC-28
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | QLCC | |
Package Description | QCCN, LCC28,.45SQ | |
Pin Count | 28 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 50 ns | |
JESD-30 Code | S-CQCC-N28 | |
JESD-609 Code | e0 | |
Length | 11.43 mm | |
Memory Density | 16384 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 512 words | |
Number of Words Code | 2000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 2KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QCCN | |
Package Equivalence Code | LCC28,.45SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Seated Height-Max | 1.905 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 11.43 mm |
Alternate Parts for AM27S25/B3C
This table gives cross-reference parts and alternative options found for AM27S25/B3C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S25/B3C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
5962-88518043X | OTP ROM, 512X8, CMOS, CQCC28, | Teledyne e2v | AM27S25/B3C vs 5962-88518043X |
5962-88518073A | OTP ROM, 512X8, 25ns, CMOS, CQCC28, | Teledyne e2v | AM27S25/B3C vs 5962-88518073A |
5962-88518073X | OTP ROM, 512X8, CMOS, CQCC28, | Teledyne e2v | AM27S25/B3C vs 5962-88518073X |
AM27S25A/B3A | OTP ROM, 512X8, Bipolar, CQCC28, CERAMIC, LCC-28 | Rochester Electronics LLC | AM27S25/B3C vs AM27S25A/B3A |