Part Details for MB832000-20M by FUJITSU Semiconductor Limited
Overview of MB832000-20M by FUJITSU Semiconductor Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (7 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MB832000-20M
MB832000-20M CAD Models
MB832000-20M Part Data Attributes
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MB832000-20M
FUJITSU Semiconductor Limited
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Datasheet
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MB832000-20M
FUJITSU Semiconductor Limited
MASK ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FUJITSU SEMICONDUCTOR AMERICA INC | |
| Package Description | PLASTIC, DIP-32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 120 ns | |
| JESD-30 Code | R-PDIP-T32 | |
| Length | 40.44 mm | |
| Memory Density | 32768 bit | |
| Memory IC Type | MASK ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5 mm | |
| Supply Current-Max | 0.04 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for MB832000-20M
This table gives cross-reference parts and alternative options found for MB832000-20M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MB832000-20M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MS312002-20PC | MASK ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 | Mosel Vitelic Corporation | MB832000-20M vs MS312002-20PC |
| KM23C2000-20 | MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Samsung Semiconductor | MB832000-20M vs KM23C2000-20 |
| S632000C-C | MASK ROM, 256KX8, 200ns, CMOS, CDIP32 | Gould Ami | MB832000-20M vs S632000C-C |
| HN62302BP-20 | 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 | Renesas Electronics Corporation | MB832000-20M vs HN62302BP-20 |
| MX23C2000PC-20 | MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Macronix International Co Ltd | MB832000-20M vs MX23C2000PC-20 |
| MB832000-20M | 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 | FUJITSU Limited | MB832000-20M vs MB832000-20M |
| MB832000-20P | 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 | FUJITSU Limited | MB832000-20M vs MB832000-20P |
| HM23C2002AP-20 | MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Hualon Microelectronics Corp | MB832000-20M vs HM23C2002AP-20 |