Memory
M38510/22401BYX
Description: UVPROM, 32KX8, 250ns, MOS, 0.5 X 0.625 INCH, DIP-28

Overview of M38510/22401BYX by Intel Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Aerospace and Defense Transportation and Logistics Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
M38510/12907BPA Rochester Electronics LLC And Gate Based Peripheral Driver, 2 Driver, 0.5A, BIPolar, CDIP8, CERAMIC, DIP-8
54LS242/BCA Rochester Electronics LLC 54LS242/BCA (DM: M38510/32801BCA)
5438/BCA Rochester Electronics 5438/BCA (DM: M38510/00303BCA)

CAD Models for M38510/22401BYX by Intel Corporation
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Part Data Attributes for M38510/22401BYX by Intel Corporation

M38510/22401BYX
Intel Corporation
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTEL CORP
Part Package Code
DIP
Package Description
DIP,
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
250 ns
JESD-30 Code
R-XDIP-T28
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Package Body Material
UNSPECIFIED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
MOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Want to compare parts?
  1. M38510/22401BYX
    Intel Corporation
    UVPROM, 32KX8, 250ns, MOS, 0.5 X 0.625 INCH, DIP-28
    VS

Alternate Parts for M38510/22401BYX

This table gives cross-reference parts and alternative options found for M38510/22401BYX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/22401BYX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
27C256MQ7B/Y25 UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Thales Group M38510/22401BYX vs 27C256MQ7B/Y25
DM27C256-25 UVPROM, 32KX8, 250ns, CMOS, CDIP28 LSI Corporation M38510/22401BYX vs DM27C256-25
8411102YX UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation M38510/22401BYX vs 8411102YX
5962-8606312XA UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v M38510/22401BYX vs 5962-8606312XA
27C256MQ25 UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v M38510/22401BYX vs 27C256MQ25
5962-8606302XX 32KX8 UVPROM, 250ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments M38510/22401BYX vs 5962-8606302XX
5962-8606312QXX UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Cypress Semiconductor M38510/22401BYX vs 5962-8606312QXX
27C256MQB/C25 UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Thales Group M38510/22401BYX vs 27C256MQB/C25
5962-8606302XX UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation M38510/22401BYX vs 5962-8606302XX
27C256MQG/B25 UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v M38510/22401BYX vs 27C256MQG/B25
Part Number Description Manufacturer Compare
27C256/BXA-25 UVPROM, 32KX8, 250ns, CMOS, CDIP28 YAGEO Corporation M38510/22401BYX vs 27C256/BXA-25
M38510/22401BYX UVPROM, 32KX8, 250ns, MOS, 0.5 X 0.625 INCH, DIP-28 AMD M38510/22401BYX vs M38510/22401BYX
5662-860632YA UVPROM, 32KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v M38510/22401BYX vs 5662-860632YA
5962-8606302XX UVPROM, 32KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 Atmel Corporation M38510/22401BYX vs 5962-8606302XX
DQ27C256-25 UVPROM, 32KX8, 250ns, CMOS, CDIP28 LSI Corporation M38510/22401BYX vs DQ27C256-25
5962-8606312QXA UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Cypress Semiconductor M38510/22401BYX vs 5962-8606312QXA
QP27C256L-250/YA UVPROM, 32KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v M38510/22401BYX vs QP27C256L-250/YA
27C256MQ25 UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v M38510/22401BYX vs 27C256MQ25
27C256MQB/C25 UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v M38510/22401BYX vs 27C256MQB/C25
8411102YA UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Rochester Electronics LLC M38510/22401BYX vs 8411102YA

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