Part Details for 27C256/BXA-25 by YAGEO Corporation
Overview of 27C256/BXA-25 by YAGEO Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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MD27C256-15/B | Rochester Electronics LLC | MD27C256-15/B | |
AM27C256-70PI | Rochester Electronics LLC | OTP ROM, 32KX8, 70ns, CMOS, PDIP28, DIP-28 | |
MD27C256-20/B | Rochester Electronics LLC | Replacement for Intel part number MD27C256-20. Buy from authorized manufacturer Rochester Electronics. |
Part Details for 27C256/BXA-25
27C256/BXA-25 CAD Models
27C256/BXA-25 Part Data Attributes
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27C256/BXA-25
YAGEO Corporation
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Datasheet
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27C256/BXA-25
YAGEO Corporation
UVPROM, 32KX8, 250ns, CMOS, CDIP28
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | PHILIPS COMPONENTS | |
Package Description | , | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 250 ns | |
JESD-30 Code | R-CDIP-T28 | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Supply Current-Max | 0.01 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Position | DUAL |
Alternate Parts for 27C256/BXA-25
This table gives cross-reference parts and alternative options found for 27C256/BXA-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C256/BXA-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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5962-8606312XA | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | 27C256/BXA-25 vs 5962-8606312XA |
M38510/22401BYA | UVPROM, 32KX8, 250ns, MOS, 0.5 X 0.625 INCH, DIP-28 | AMD | 27C256/BXA-25 vs M38510/22401BYA |
8411102YX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Intel Corporation | 27C256/BXA-25 vs 8411102YX |
5962-8606302XX | 32K X 8 UVPROM, 250 ns, CDIP28, CERAMIC, DIP-28 | Microchip Technology Inc | 27C256/BXA-25 vs 5962-8606302XX |
5662-860632YA | UVPROM, 32KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | 27C256/BXA-25 vs 5662-860632YA |
DM27C256-25/B | UVPROM, 32KX8, 250ns, CMOS, CDIP28 | LSI Corporation | 27C256/BXA-25 vs DM27C256-25/B |
27C256MQ25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 27C256/BXA-25 vs 27C256MQ25 |
5962-8606312QXX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 27C256/BXA-25 vs 5962-8606312QXX |
5962-8606312QXA | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Cypress Semiconductor | 27C256/BXA-25 vs 5962-8606312QXA |
8411102YX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | AMD | 27C256/BXA-25 vs 8411102YX |