M38510/22401BYX vs DQ27C256-25 feature comparison

M38510/22401BYX Intel Corporation

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DQ27C256-25 LSI Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP SEEQ TECHNOLOGY INC
Part Package Code DIP
Package Description DIP, DIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
JESD-30 Code R-XDIP-T28 R-GDIP-T28
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 32KX8 32KX8
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.05 mA 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology MOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
Additional Feature DATA RETENTION > 10 YEARS
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.6
Programming Voltage 12.5 V
Standby Current-Max 0.0001 A
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm

Compare M38510/22401BYX with alternatives

Compare DQ27C256-25 with alternatives