Datasheets
LH532200BD-15 by: Sharp Corp

MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

Part Details for LH532200BD-15 by Sharp Corp

Overview of LH532200BD-15 by Sharp Corp

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Applications Environmental Monitoring Industrial Automation Agriculture Technology Virtual Reality (VR), Augmented Reality (AR), and Vision Systems

Part Details for LH532200BD-15

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LH532200BD-15 Part Data Attributes

LH532200BD-15 Sharp Corp
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LH532200BD-15 Sharp Corp MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SHARP CORP
Package Description 0.600 INCH, PLASTIC, DIP-32
Reach Compliance Code unknown
Access Time-Max 150 ns
JESD-30 Code R-PDIP-T32
JESD-609 Code e0
Memory Density 2097152 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for LH532200BD-15

This table gives cross-reference parts and alternative options found for LH532200BD-15. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LH532200BD-15, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
LH532100BD MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp LH532200BD-15 vs LH532100BD
KM23C2001-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor LH532200BD-15 vs KM23C2001-15
MN232002 MASK ROM, 256KX8, 150ns, NMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Panasonic Electronic Components LH532200BD-15 vs MN232002
MS312001-15PC MASK ROM, 256KX8, 150ns, CMOS, PDIP32, P32-1 Mosel Vitelic Corporation LH532200BD-15 vs MS312001-15PC
GM23C2000-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, Goldstar Electron Co Ltd LH532200BD-15 vs GM23C2000-15
AM27X020-155PI MASK ROM, 256KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD LH532200BD-15 vs AM27X020-155PI
KM23C2000-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor LH532200BD-15 vs KM23C2000-15
HM23C2002P-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hualon Microelectronics Corp LH532200BD-15 vs HM23C2002P-15
Part Number Description Manufacturer Compare
LH532100BD MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp LH532200BD-15 vs LH532100BD
HM23C2002P-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hualon Microelectronics Corp LH532200BD-15 vs HM23C2002P-15
AM27X020-155PI MASK ROM, 256KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD LH532200BD-15 vs AM27X020-155PI
KM23C2001-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor LH532200BD-15 vs KM23C2001-15
MN232002 MASK ROM, 256KX8, 150ns, NMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Panasonic Electronic Components LH532200BD-15 vs MN232002
GM23C2000-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, Goldstar Electron Co Ltd LH532200BD-15 vs GM23C2000-15
MX23C2000PC-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd LH532200BD-15 vs MX23C2000PC-15
MS312001-15PC MASK ROM, 256KX8, 150ns, CMOS, PDIP32, P32-1 Mosel Vitelic Corporation LH532200BD-15 vs MS312001-15PC

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