Datasheets
MN232002 by: Panasonic Electronic Components

MASK ROM, 256KX8, 150ns, NMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

Part Details for MN232002 by Panasonic Electronic Components

Overview of MN232002 by Panasonic Electronic Components

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Applications Environmental Monitoring Agriculture Technology Telecommunications

Part Details for MN232002

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MN232002 Part Data Attributes

MN232002 Panasonic Electronic Components
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MN232002 Panasonic Electronic Components MASK ROM, 256KX8, 150ns, NMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Part Life Cycle Code Obsolete
Ihs Manufacturer PANASONIC CORP
Part Package Code DIP
Package Description DIP,
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 200 ns
JESD-30 Code R-PDIP-T32
Length 42.1 mm
Memory Density 8388608 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Organization 1MX8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for MN232002

This table gives cross-reference parts and alternative options found for MN232002. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MN232002, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
LH532100BD MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp MN232002 vs LH532100BD
KM23C2001-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor MN232002 vs KM23C2001-15
MS312001-15PC MASK ROM, 256KX8, 150ns, CMOS, PDIP32, P32-1 Mosel Vitelic Corporation MN232002 vs MS312001-15PC
GM23C2000-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, Goldstar Electron Co Ltd MN232002 vs GM23C2000-15
AM27X020-155PI MASK ROM, 256KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD MN232002 vs AM27X020-155PI
KM23C2000-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor MN232002 vs KM23C2000-15
HM23C2002P-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hualon Microelectronics Corp MN232002 vs HM23C2002P-15
Part Number Description Manufacturer Compare
LH532100BD MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp MN232002 vs LH532100BD
HM23C2002P-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hualon Microelectronics Corp MN232002 vs HM23C2002P-15
AM27X020-155PI MASK ROM, 256KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD MN232002 vs AM27X020-155PI
KM23C2001-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor MN232002 vs KM23C2001-15
GM23C2000-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, Goldstar Electron Co Ltd MN232002 vs GM23C2000-15
MX23C2000PC-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd MN232002 vs MX23C2000PC-15
MS312001-15PC MASK ROM, 256KX8, 150ns, CMOS, PDIP32, P32-1 Mosel Vitelic Corporation MN232002 vs MS312001-15PC

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