Part Details for KM23C8000-20 by Samsung Semiconductor
Overview of KM23C8000-20 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for KM23C8000-20
KM23C8000-20 CAD Models
KM23C8000-20 Part Data Attributes
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KM23C8000-20
Samsung Semiconductor
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Datasheet
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KM23C8000-20
Samsung Semiconductor
MASK ROM, 1MX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-PDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 41.91 mm | |
| Memory Density | 8388608 bit | |
| Memory IC Type | MASK ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for KM23C8000-20
This table gives cross-reference parts and alternative options found for KM23C8000-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of KM23C8000-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| LH538100D-20 | MASK ROM, 1MX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Sharp Corp | KM23C8000-20 vs LH538100D-20 |
| SC18052CN | MASK ROM, 1MX8, 200ns, MOS, PDIP32, | Sierra Semiconductor | KM23C8000-20 vs SC18052CN |
| MS318002-20PC | MASK ROM, 1MX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 | Mosel Vitelic Corporation | KM23C8000-20 vs MS318002-20PC |
| HN62328BP-20 | 1MX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 | Renesas Electronics Corporation | KM23C8000-20 vs HN62328BP-20 |
| KM23C8000A-20 | MASK ROM, 1MX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Samsung Semiconductor | KM23C8000-20 vs KM23C8000A-20 |
| HN62328BP | 1MX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 | Renesas Electronics Corporation | KM23C8000-20 vs HN62328BP |
| KM23C8001A-20 | MASK ROM, 1MX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Samsung Semiconductor | KM23C8000-20 vs KM23C8001A-20 |
| MN238002 | MASK ROM, 1MX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Panasonic Electronic Components | KM23C8000-20 vs MN238002 |
| HN62328BP | MASK ROM, 1MX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 | Hitachi Ltd | KM23C8000-20 vs HN62328BP |
| LH538200D-20 | MASK ROM, 1MX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Sharp Corp | KM23C8000-20 vs LH538200D-20 |