Datasheets
K8D3216UBC-PC070 by: Samsung Semiconductor

Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48

Part Details for K8D3216UBC-PC070 by Samsung Semiconductor

Overview of K8D3216UBC-PC070 by Samsung Semiconductor

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Part Details for K8D3216UBC-PC070

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K8D3216UBC-PC070 Part Data Attributes

K8D3216UBC-PC070 Samsung Semiconductor
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K8D3216UBC-PC070 Samsung Semiconductor Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP1
Package Description 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Pin Count 48
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns
Alternate Memory Width 8
Boot Block BOTTOM
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PDSO-G48
Length 18.4 mm
Memory Density 33554432 bit
Memory IC Type FLASH
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 8,63
Number of Terminals 48
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX16
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL
Programming Voltage 2.7 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 8K,64K
Standby Current-Max 0.000018 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Toggle Bit YES
Type NOR TYPE
Width 12 mm

Alternate Parts for K8D3216UBC-PC070

This table gives cross-reference parts and alternative options found for K8D3216UBC-PC070. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K8D3216UBC-PC070, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
SST36VF3204-70-4E-EKE Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 Silicon Storage Technology K8D3216UBC-PC070 vs SST36VF3204-70-4E-EKE
SST39VF3201-70-4C-EKE-T 2M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 Microchip Technology Inc K8D3216UBC-PC070 vs SST39VF3201-70-4C-EKE-T
SST36VF3203-70-4C-EKE 2M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 Microchip Technology Inc K8D3216UBC-PC070 vs SST36VF3203-70-4C-EKE
SST36VF3203-70-4C-EK Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, MO-142DD, TSOP1-48 Silicon Storage Technology K8D3216UBC-PC070 vs SST36VF3203-70-4C-EK
SST39VF3201-70-4C-EKE 2M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 Microchip Technology Inc K8D3216UBC-PC070 vs SST39VF3201-70-4C-EKE
SST36VF3203-70-4I-EKE 2M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 Microchip Technology Inc K8D3216UBC-PC070 vs SST36VF3203-70-4I-EKE
TE28F320B3BC70 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, TSOP-48 Intel Corporation K8D3216UBC-PC070 vs TE28F320B3BC70
K8D3216UBC-PI070 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Samsung Semiconductor K8D3216UBC-PC070 vs K8D3216UBC-PI070
TE28F320B3TD70 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, TSOP-48 Intel Corporation K8D3216UBC-PC070 vs TE28F320B3TD70
K8D3216UBCPC0700 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Samsung Semiconductor K8D3216UBC-PC070 vs K8D3216UBCPC0700
Part Number Description Manufacturer Compare
K8D3216UBC-FI070 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, FBGA-48 Samsung Semiconductor K8D3216UBC-PC070 vs K8D3216UBC-FI070
K8D3216UBC-DC070 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 Samsung Semiconductor K8D3216UBC-PC070 vs K8D3216UBC-DC070
K8D3216UBC-DI070 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 Samsung Semiconductor K8D3216UBC-PC070 vs K8D3216UBC-DI070
K8D3216UBCYI0700 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Samsung Semiconductor K8D3216UBC-PC070 vs K8D3216UBCYI0700
SST39VF3201-70-4C-B3K Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, MO-210AB-1, TFBGA-48 Silicon Storage Technology K8D3216UBC-PC070 vs SST39VF3201-70-4C-B3K
K8D3216UBC-YC070 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Samsung Semiconductor K8D3216UBC-PC070 vs K8D3216UBC-YC070
SST39VF3201B-70-4I-EKE-T 2M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 Microchip Technology Inc K8D3216UBC-PC070 vs SST39VF3201B-70-4I-EKE-T
K8D3216UBC-PI070 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Samsung Semiconductor K8D3216UBC-PC070 vs K8D3216UBC-PI070
SST36VF3203-70-4E-EKE 2M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 Microchip Technology Inc K8D3216UBC-PC070 vs SST36VF3203-70-4E-EKE
K8D3216UBC-TC070 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 Samsung Semiconductor K8D3216UBC-PC070 vs K8D3216UBC-TC070

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