Part Details for K7I641882M-EC30 by Samsung Semiconductor
Overview of K7I641882M-EC30 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| PHEC30P-S211LF | Amphenol Communications Solutions | PHEN/PHEC Board-to-Board Connector, Straight Plug, 1.27mm (0.05inch). |
Part Details for K7I641882M-EC30
K7I641882M-EC30 CAD Models
K7I641882M-EC30 Part Data Attributes
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K7I641882M-EC30
Samsung Semiconductor
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Datasheet
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K7I641882M-EC30
Samsung Semiconductor
Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Package Description | BGA, BGA165,11X15,40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e3 | |
| Memory Density | 75497472 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Voltage-Min | 1.7 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM |
Alternate Parts for K7I641882M-EC30
This table gives cross-reference parts and alternative options found for K7I641882M-EC30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7I641882M-EC30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1518V18-300BZXC | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | K7I641882M-EC30 vs CY7C1518V18-300BZXC |
| GS8672T18BGE-300 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | GSI Technology | K7I641882M-EC30 vs GS8672T18BGE-300 |
| CY7C1518JV18-300BZXC | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | K7I641882M-EC30 vs CY7C1518JV18-300BZXC |
| GS8662T18BGD-300T | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | K7I641882M-EC30 vs GS8662T18BGD-300T |
| UPD44644182AF5-E33-FQ1-A | 4MX18 DDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 | Renesas Electronics Corporation | K7I641882M-EC30 vs UPD44644182AF5-E33-FQ1-A |
| GS8662T18BD-300T | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | K7I641882M-EC30 vs GS8662T18BD-300T |
| GS8672T18BGE-300T | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | GSI Technology | K7I641882M-EC30 vs GS8672T18BGE-300T |
| CY7C1518AV18-300BZXC | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | K7I641882M-EC30 vs CY7C1518AV18-300BZXC |
| K7I641882M-EC300 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | Samsung Semiconductor | K7I641882M-EC30 vs K7I641882M-EC300 |
| GS8672T18BE-300 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | GSI Technology | K7I641882M-EC30 vs GS8672T18BE-300 |