K7I641882M-EC30 vs UPD44644182AF5-E33-FQ1-A feature comparison

K7I641882M-EC30 Samsung Semiconductor

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UPD44644182AF5-E33-FQ1-A Renesas Electronics Corporation

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC RENESAS ELECTRONICS CORP
Package Description BGA, BGA165,11X15,40 LBGA, BGA165,11X15,40
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Clock Frequency-Max (fCLK) 300 MHz 300 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e3
Memory Density 75497472 bit 75497472 bit
Memory IC Type STANDARD SRAM DDR SRAM
Memory Width 18 18
Moisture Sensitivity Level 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX18 4MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 1.7 V 1.7 V
Surface Mount YES YES
Technology CMOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 3 1
Part Package Code BGA
Pin Count 165
Length 17 mm
Number of Functions 1
Seated Height-Max 1.46 mm
Supply Current-Max 0.56 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Width 15 mm

Compare K7I641882M-EC30 with alternatives

Compare UPD44644182AF5-E33-FQ1-A with alternatives