Part Details for K6X0808C1D-GF55 by Samsung Semiconductor
Overview of K6X0808C1D-GF55 by Samsung Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (6 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for K6X0808C1D-GF55
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Chip 1 Exchange | INSTOCK | 618 |
|
RFQ |
Part Details for K6X0808C1D-GF55
K6X0808C1D-GF55 CAD Models
K6X0808C1D-GF55 Part Data Attributes:
|
K6X0808C1D-GF55
Samsung Semiconductor
Buy Now
Datasheet
|
Compare Parts:
K6X0808C1D-GF55
Samsung Semiconductor
Standard SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.450 INCH, SOP-28
|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | SOIC | |
Package Description | 0.450 INCH, SOP-28 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 55 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PDSO-G28 | |
JESD-609 Code | e0 | |
Length | 18.29 mm | |
Memory Density | 262144 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP28,.45 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 240 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3 mm | |
Standby Current-Max | 0.00001 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 8.38 mm |
Alternate Parts for K6X0808C1D-GF55
This table gives cross-reference parts and alternative options found for K6X0808C1D-GF55. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K6X0808C1D-GF55, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CY62256NLL-55SNI | Standard SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.300 INCH, SOIC-28 | Cypress Semiconductor | K6X0808C1D-GF55 vs CY62256NLL-55SNI |
K6X0808C1D-BF550 | Standard SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.450 INCH, LEAD FREE, PLASTIC, SOP-28 | Samsung Semiconductor | K6X0808C1D-GF55 vs K6X0808C1D-BF550 |
CY62256NLL-55SNIT | Standard SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.300 INCH, SOIC-28 | Cypress Semiconductor | K6X0808C1D-GF55 vs CY62256NLL-55SNIT |
CY62256NLL-55SNXE | Standard SRAM, 32KX8, 55ns, CMOS, PDSO28, SOP-28 | Alliance Memory Inc | K6X0808C1D-GF55 vs CY62256NLL-55SNXE |
CY62256NLL-55SNXI | Standard SRAM, 32KX8, 55ns, CMOS, PDSO28, SOP-28 | Alliance Memory Inc | K6X0808C1D-GF55 vs CY62256NLL-55SNXI |
K6X0808C1D-GF550 | Standard SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28 | Samsung Semiconductor | K6X0808C1D-GF55 vs K6X0808C1D-GF550 |