Datasheets
K4H510838G-LLB30 by: Samsung Semiconductor

DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66,

Part Details for K4H510838G-LLB30 by Samsung Semiconductor

Overview of K4H510838G-LLB30 by Samsung Semiconductor

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Applications Consumer Electronics Computing and Data Storage Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Entertainment and Gaming

Part Details for K4H510838G-LLB30

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K4H510838G-LLB30 Part Data Attributes

K4H510838G-LLB30 Samsung Semiconductor
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K4H510838G-LLB30 Samsung Semiconductor DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66,
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.28
Access Time-Max 0.7 ns
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PDSO-G66
JESD-609 Code e6
Memory Density 536870912 bit
Memory IC Type DDR1 DRAM
Memory Width 8
Moisture Sensitivity Level 3
Number of Terminals 66
Number of Words 67108864 words
Number of Words Code 64000000
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP66,.46
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Sequential Burst Length 2,4,8
Standby Current-Max 0.005 A
Supply Current-Max 0.22 mA
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN BISMUTH
Terminal Form GULL WING
Terminal Pitch 0.635 mm
Terminal Position DUAL

Alternate Parts for K4H510838G-LLB30

This table gives cross-reference parts and alternative options found for K4H510838G-LLB30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4H510838G-LLB30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MT46V64M8P-6TL:F DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838G-LLB30 vs MT46V64M8P-6TL:F
K4H510838B-TCB3 DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor K4H510838G-LLB30 vs K4H510838B-TCB3
H5DU5182ETR-J3L DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 SK Hynix Inc K4H510838G-LLB30 vs H5DU5182ETR-J3L
K4H510838B-TCB30 DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor K4H510838G-LLB30 vs K4H510838B-TCB30
K4H510838D-UCB30 DDR DRAM, 64MX8, 0.6ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor K4H510838G-LLB30 vs K4H510838D-UCB30
K4H510838C-UCB3T DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor K4H510838G-LLB30 vs K4H510838C-UCB3T
K4H510838D-ULB30 DDR DRAM, 64MX8, 0.6ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor K4H510838G-LLB30 vs K4H510838D-ULB30
MT46V64M8TG-6T:D DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc K4H510838G-LLB30 vs MT46V64M8TG-6T:D
MT46V64M8P-6T:D DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838G-LLB30 vs MT46V64M8P-6T:D
K4H510838C-UCB30 DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor K4H510838G-LLB30 vs K4H510838C-UCB30
Part Number Description Manufacturer Compare
K4H510838B-TLB00 DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor K4H510838G-LLB30 vs K4H510838B-TLB00
HY5DU12822BTP-D43 DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc K4H510838G-LLB30 vs HY5DU12822BTP-D43
MT46V64M8TG-75ZIT:C DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc K4H510838G-LLB30 vs MT46V64M8TG-75ZIT:C
HYB25D512800AE-6 DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, PLASTIC, TSOP2-66 Infineon Technologies AG K4H510838G-LLB30 vs HYB25D512800AE-6
MT46V64M8P-75ZL:F DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838G-LLB30 vs MT46V64M8P-75ZL:F
HY5DU12822BTP-K DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc K4H510838G-LLB30 vs HY5DU12822BTP-K
MT46V64M8STG-75:C DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838G-LLB30 vs MT46V64M8STG-75:C
V58C2512804SDLI8H DDR DRAM, 64MX8, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H510838G-LLB30 vs V58C2512804SDLI8H
MT46V64M8P-5B:J DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838G-LLB30 vs MT46V64M8P-5B:J
V58C2512804SDLI8E DDR DRAM, 64MX8, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H510838G-LLB30 vs V58C2512804SDLI8E

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