Memory
K4H510838B-TLB00
Samsung Semiconductor
Description: DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66

Overview of K4H510838B-TLB00 by Samsung Semiconductor

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Consumer Electronics Computing and Data Storage Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Entertainment and Gaming

CAD Models for K4H510838B-TLB00 by Samsung Semiconductor
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Part Data Attributes for K4H510838B-TLB00 by Samsung Semiconductor

K4H510838B-TLB00
Samsung Semiconductor
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP2
Package Description
TSOP2, TSSOP66,.46
Pin Count
66
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
0.75 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8
JESD-30 Code
R-PDSO-G66
JESD-609 Code
e0
Length
22.22 mm
Memory Density
536870912 bit
Memory IC Type
DDR1 DRAM
Memory Width
8
Number of Functions
1
Number of Ports
1
Number of Terminals
66
Number of Words
67108864 words
Number of Words Code
64000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
64MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
TSOP2
Package Equivalence Code
TSSOP66,.46
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
Qualification Status
Not Qualified
Refresh Cycles
8192
Seated Height-Max
1.2 mm
Self Refresh
YES
Sequential Burst Length
2,4,8
Standby Current-Max
0.005 A
Supply Current-Max
0.34 mA
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
DUAL
Width
10.16 mm
Want to compare parts?
  1. K4H510838B-TLB00
    Samsung Semiconductor
    DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66
    VS

Alternate Parts for K4H510838B-TLB00

This table gives cross-reference parts and alternative options found for K4H510838B-TLB00. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4H510838B-TLB00, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
MT46V64M8TG-75L:C DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8TG-75L:C
MT46V64M8P-75:D DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8P-75:D
MT46V64M8P-75:F DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8P-75:F
MT46V64M8TG-75Z DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8TG-75Z
K4H510838B-TLAA DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor K4H510838B-TLB00 vs K4H510838B-TLAA
MT46V64M8TG-75E:D DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8TG-75E:D
MT46V64M8TG-75Z:C DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8TG-75Z:C
MT46V64M8TG-75E:C DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8TG-75E:C
MT46V64M8P-75ZL DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8P-75ZL
MT46V64M8TG-75ZL:F DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8TG-75ZL:F
Part Number Description Manufacturer Compare
HY5DU12822BTP-D43 DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc K4H510838B-TLB00 vs HY5DU12822BTP-D43
MT46V64M8TG-75ZIT:C DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8TG-75ZIT:C
HYB25D512800AE-6 DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, PLASTIC, TSOP2-66 Infineon Technologies AG K4H510838B-TLB00 vs HYB25D512800AE-6
MT46V64M8P-75ZL:F DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8P-75ZL:F
HY5DU12822BTP-K DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc K4H510838B-TLB00 vs HY5DU12822BTP-K
MT46V64M8STG-75:C DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8STG-75:C
V58C2512804SDLI8H DDR DRAM, 64MX8, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H510838B-TLB00 vs V58C2512804SDLI8H
MT46V64M8P-5B:J DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc K4H510838B-TLB00 vs MT46V64M8P-5B:J
V58C2512804SDLI8E DDR DRAM, 64MX8, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H510838B-TLB00 vs V58C2512804SDLI8E
K4H510838M-TCA20 DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor K4H510838B-TLB00 vs K4H510838M-TCA20

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