Memory
K3N4C3000D-GC10
Samsung Semiconductor
Description: MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32

Overview of K3N4C3000D-GC10 by Samsung Semiconductor

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Where used in Applications: Automotive

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Part Data Attributes for K3N4C3000D-GC10 by Samsung Semiconductor

K3N4C3000D-GC10
Samsung Semiconductor
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
Package Description
SOP, SOP32,.56
Pin Count
32
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
100 ns
Additional Feature
TTL COMPATIBLE I/O
JESD-30 Code
R-PDSO-G32
JESD-609 Code
e0
Length
20.47 mm
Memory Density
8388608 bit
Memory IC Type
MASK ROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
1048576 words
Number of Words Code
1000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
1MX8
Package Body Material
PLASTIC/EPOXY
Package Code
SOP
Package Equivalence Code
SOP32,.56
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
3 mm
Standby Current-Max
0.00005 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Width
11.43 mm
Want to compare parts?
  1. K3N4C3000D-GC10
    Samsung Semiconductor
    MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32
    VS

Alternate Parts for K3N4C3000D-GC10

This table gives cross-reference parts and alternative options found for K3N4C3000D-GC10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K3N4C3000D-GC10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
KM23C8000DG MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32 Samsung Semiconductor K3N4C3000D-GC10 vs KM23C8000DG
KM23C8000HG-10 MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Samsung Semiconductor K3N4C3000D-GC10 vs KM23C8000HG-10
KM23C8001BG-10 MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Samsung Semiconductor K3N4C3000D-GC10 vs KM23C8001BG-10
LH538700AS MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32 Sharp Corp K3N4C3000D-GC10 vs LH538700AS
KM23C8005BG-10 MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Samsung Semiconductor K3N4C3000D-GC10 vs KM23C8005BG-10
KM23C8000DG-10 MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32 Samsung Semiconductor K3N4C3000D-GC10 vs KM23C8000DG-10
MSM538001E-XXGS-K MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32 OKI Electric Industry Co Ltd K3N4C3000D-GC10 vs MSM538001E-XXGS-K
HN62338BF-10 1MX8 MASK PROM, 100ns, PDSO32, PLASTIC, SOP-32 Renesas Electronics Corporation K3N4C3000D-GC10 vs HN62338BF-10
MSM538021C-GS-K 1M X 8 MASK PROM, 100 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32 OKI Electric Industry Co Ltd K3N4C3000D-GC10 vs MSM538021C-GS-K
HN62338BTT-10 1MX8 MASK PROM, 100ns, PDSO32, PLASTIC, TSOP2-32 Renesas Electronics Corporation K3N4C3000D-GC10 vs HN62338BTT-10
Part Number Description Manufacturer Compare
M27W801-120N6 1MX8 OTPROM, 120ns, PDSO32, 8 X 20 MM, PLASTIC, TSOP-32 STMicroelectronics K3N4C3000D-GC10 vs M27W801-120N6
HN62328BF-15 MASK ROM, 1MX8, 150ns, CMOS, PDSO32, PLASTIC, SOP-32 Hitachi Ltd K3N4C3000D-GC10 vs HN62328BF-15
HN62328BF 1MX8 MASK PROM, 200ns, PDSO32, PLASTIC, SOP-32 Renesas Electronics Corporation K3N4C3000D-GC10 vs HN62328BF
MSM538001E-XXGS-K MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32 OKI Electric Industry Co Ltd K3N4C3000D-GC10 vs MSM538001E-XXGS-K
KM23C8000DG-10 MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32 Samsung Semiconductor K3N4C3000D-GC10 vs KM23C8000DG-10
KM23C8000DG-12 MASK ROM, 1MX8, 120ns, CMOS, PDSO32, 0.525 INCH, SOP-32 Samsung Semiconductor K3N4C3000D-GC10 vs KM23C8000DG-12
AT27LV080-20RCT/R OTP ROM, 1MX8, 200ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOIC-32 Atmel Corporation K3N4C3000D-GC10 vs AT27LV080-20RCT/R
KM23C8000G-25 MASK ROM, 1MX8, 250ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Samsung Semiconductor K3N4C3000D-GC10 vs KM23C8000G-25
AT27LV080-30TCT/R OTP ROM, 1MX8, 300ns, CMOS, PDSO32, PLASTIC, TSOP-32 Atmel Corporation K3N4C3000D-GC10 vs AT27LV080-30TCT/R
KM23C8000AG-15 MASK ROM, 1MX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Samsung Semiconductor K3N4C3000D-GC10 vs KM23C8000AG-15

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