Memory
K3N3C3000D-DC120
Samsung Semiconductor
Description: MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32

Overview of K3N3C3000D-DC120 by Samsung Semiconductor

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Where used in Applications: Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

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Part Data Attributes for K3N3C3000D-DC120 by Samsung Semiconductor

K3N3C3000D-DC120
Samsung Semiconductor
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP,
Pin Count
32
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
120 ns
JESD-30 Code
R-PDIP-T32
Length
41.91 mm
Memory Density
4194304 bit
Memory IC Type
MASK ROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
512KX8
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
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  1. K3N3C3000D-DC120
    Samsung Semiconductor
    MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32
    VS

Alternate Parts for K3N3C3000D-DC120

This table gives cross-reference parts and alternative options found for K3N3C3000D-DC120. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K3N3C3000D-DC120, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
KM23C4001B-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor K3N3C3000D-DC120 vs KM23C4001B-12
LH534R00D-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp K3N3C3000D-DC120 vs LH534R00D-12
KM23C4000A-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor K3N3C3000D-DC120 vs KM23C4000A-12
LH534R00AD MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp K3N3C3000D-DC120 vs LH534R00AD
MSM534001B-RS MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 OKI Electric Industry Co Ltd K3N3C3000D-DC120 vs MSM534001B-RS
UPD23C4001EJCZ-XXX MASK ROM, 512KX8, 120ns, MOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 NEC Electronics Group K3N3C3000D-DC120 vs UPD23C4001EJCZ-XXX
KM23C4000H-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor K3N3C3000D-DC120 vs KM23C4000H-12
KM23C4000D-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32 Samsung Semiconductor K3N3C3000D-DC120 vs KM23C4000D-12
MSM534001CRS MASK ROM, 512KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 OKI Electric Industry Co Ltd K3N3C3000D-DC120 vs MSM534001CRS
TC534000CP IC 512K X 8 MASK PROM, 120 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM Toshiba America Electronic Components K3N3C3000D-DC120 vs TC534000CP
Part Number Description Manufacturer Compare
UPD23C4001EJCZ-XXX MASK ROM, 512KX8, 120ns, MOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 NEC Electronics Group K3N3C3000D-DC120 vs UPD23C4001EJCZ-XXX
MS314001-12PC MASK ROM, 512KX8, 120ns, CMOS, PDIP32, P32-1 Mosel Vitelic Corporation K3N3C3000D-DC120 vs MS314001-12PC
KM23C4000A-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor K3N3C3000D-DC120 vs KM23C4000A-12
KM23C4001B-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor K3N3C3000D-DC120 vs KM23C4001B-12
KM23C4000D-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32 Samsung Semiconductor K3N3C3000D-DC120 vs KM23C4000D-12
KM23C4000H-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor K3N3C3000D-DC120 vs KM23C4000H-12
LH534R00AD MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp K3N3C3000D-DC120 vs LH534R00AD
MSM534001CRS MASK ROM, 512KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 OKI Electric Industry Co Ltd K3N3C3000D-DC120 vs MSM534001CRS
MSM534001B-RS MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 OKI Electric Industry Co Ltd K3N3C3000D-DC120 vs MSM534001B-RS
KM23C4001H-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor K3N3C3000D-DC120 vs KM23C4001H-12

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