Datasheets
KM23C4000D-12 by: Samsung Semiconductor

MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32

Part Details for KM23C4000D-12 by Samsung Semiconductor

Overview of KM23C4000D-12 by Samsung Semiconductor

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Part Details for KM23C4000D-12

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KM23C4000D-12 Part Data Attributes

KM23C4000D-12 Samsung Semiconductor
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KM23C4000D-12 Samsung Semiconductor MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 120 ns
JESD-30 Code R-PDIP-T32
JESD-609 Code e0
Length 41.91 mm
Memory Density 4194304 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for KM23C4000D-12

This table gives cross-reference parts and alternative options found for KM23C4000D-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of KM23C4000D-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TC534000CP IC 512K X 8 MASK PROM, 120 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM Toshiba America Electronic Components KM23C4000D-12 vs TC534000CP
MX23C4000PC-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd KM23C4000D-12 vs MX23C4000PC-12
KM23C4000A-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor KM23C4000D-12 vs KM23C4000A-12
KM23C4001B-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor KM23C4000D-12 vs KM23C4001B-12
LH534R00D-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp KM23C4000D-12 vs LH534R00D-12
HY234000P-120 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 SK Hynix Inc KM23C4000D-12 vs HY234000P-120
HY23C04000D-120 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 SK Hynix Inc KM23C4000D-12 vs HY23C04000D-120
MSM534001B-RS MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 OKI Electric Industry Co Ltd KM23C4000D-12 vs MSM534001B-RS
LH534R00BD MASK ROM, 512KX8, 120ns, CMOS, PDIP32, DIP-32 Sharp Corp KM23C4000D-12 vs LH534R00BD
UPD23C4001EJCZ-XXX MASK ROM, 512KX8, 120ns, MOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 NEC Electronics Group KM23C4000D-12 vs UPD23C4001EJCZ-XXX
Part Number Description Manufacturer Compare
LH534R00BD MASK ROM, 512KX8, 120ns, CMOS, PDIP32, DIP-32 Sharp Corp KM23C4000D-12 vs LH534R00BD
LH534R00D-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp KM23C4000D-12 vs LH534R00D-12
HY234000P-120 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 SK Hynix Inc KM23C4000D-12 vs HY234000P-120
MX23C4000PC-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd KM23C4000D-12 vs MX23C4000PC-12
KM23C4000A-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor KM23C4000D-12 vs KM23C4000A-12
UPD23C4001EJCZ-XXX MASK ROM, 512KX8, 120ns, MOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 NEC Electronics Group KM23C4000D-12 vs UPD23C4001EJCZ-XXX
MSM534001B-RS MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 OKI Electric Industry Co Ltd KM23C4000D-12 vs MSM534001B-RS
KM23C4000H-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor KM23C4000D-12 vs KM23C4000H-12
HY23C04000D-120 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 SK Hynix Inc KM23C4000D-12 vs HY23C04000D-120
MS314001-12PC MASK ROM, 512KX8, 120ns, CMOS, PDIP32, P32-1 Mosel Vitelic Corporation KM23C4000D-12 vs MS314001-12PC

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