Part Details for IS61QDB22M36A-250M3 by Integrated Silicon Solution Inc
Overview of IS61QDB22M36A-250M3 by Integrated Silicon Solution Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for IS61QDB22M36A-250M3
IS61QDB22M36A-250M3 CAD Models
IS61QDB22M36A-250M3 Part Data Attributes:
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IS61QDB22M36A-250M3
Integrated Silicon Solution Inc
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Datasheet
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IS61QDB22M36A-250M3
Integrated Silicon Solution Inc
QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 250 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 17 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 1 mA | |
| Supply Voltage-Max (Vsup) | 1.89 V | |
| Supply Voltage-Min (Vsup) | 1.71 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for IS61QDB22M36A-250M3
This table gives cross-reference parts and alternative options found for IS61QDB22M36A-250M3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61QDB22M36A-250M3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1514JV18-250BZXC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | IS61QDB22M36A-250M3 vs CY7C1514JV18-250BZXC |
| K7R643682M-EC250 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | Samsung Semiconductor | IS61QDB22M36A-250M3 vs K7R643682M-EC250 |
| GS8672Q36BGE-250T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | IS61QDB22M36A-250M3 vs GS8672Q36BGE-250T |
| IS61QDB22M36-250M3 | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, LFBGA-165 | Integrated Silicon Solution Inc | IS61QDB22M36A-250M3 vs IS61QDB22M36-250M3 |
| CY7C1514KV18-250BZXC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | IS61QDB22M36A-250M3 vs CY7C1514KV18-250BZXC |
| K7R643682M-FC250 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 | Samsung Semiconductor | IS61QDB22M36A-250M3 vs K7R643682M-FC250 |
| CY7C1514AV18-250BZXC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | IS61QDB22M36A-250M3 vs CY7C1514AV18-250BZXC |
| IS61QDB22M36A-250B3 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, TFBGA-165 | Integrated Silicon Solution Inc | IS61QDB22M36A-250M3 vs IS61QDB22M36A-250B3 |
| CY7C1514AV18-250BZC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | IS61QDB22M36A-250M3 vs CY7C1514AV18-250BZC |
| CY7C1514KV18-250BZXC | QDR II SRAM, 2MX36, 0.45ns, CMOS, PBGA165, | Infineon Technologies AG | IS61QDB22M36A-250M3 vs CY7C1514KV18-250BZXC |