HYMD232M646D6-L
SK Hynix Inc
Description: DDR DRAM Module, 32MX64, 0.8ns, CMOS, PDMA200

Overview of HYMD232M646D6-L by SK Hynix Inc

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Part Data Attributes for HYMD232M646D6-L by SK Hynix Inc

HYMD232M646D6-L
SK Hynix Inc
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SK HYNIX INC
Package Description
DIMM, DIMM200,24
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.36
Access Time-Max
0.8 ns
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
JESD-30 Code
R-PDMA-N200
Memory Density
2147483648 bit
Memory IC Type
DDR DRAM MODULE
Memory Width
64
Moisture Sensitivity Level
1
Number of Terminals
200
Number of Words
33554432 words
Number of Words Code
32000000
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
32MX64
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
DIMM
Package Equivalence Code
DIMM200,24
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Refresh Cycles
8192
Standby Current-Max
0.08 A
Supply Current-Max
0.92 mA
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
NO LEAD
Terminal Pitch
0.6 mm
Terminal Position
DUAL
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  1. HYMD232M646D6-L
    SK Hynix Inc
    DDR DRAM Module, 32MX64, 0.8ns, CMOS, PDMA200
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Alternate Parts for HYMD232M646D6-L

This table gives cross-reference parts and alternative options found for HYMD232M646D6-L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYMD232M646D6-L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
HYMD232M646DL6-L DDR DRAM Module, 32MX64, 0.8ns, CMOS, PDMA200 SK Hynix Inc HYMD232M646D6-L vs HYMD232M646DL6-L
Part Number Description Manufacturer Compare
V826532K04SATG-A1 DDR DRAM Module, 32MX64, 0.8ns, CMOS, DIMM-184 Mosel Vitelic Corporation HYMD232M646D6-L vs V826532K04SATG-A1
HYMD232646C8-H DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 SK Hynix Inc HYMD232M646D6-L vs HYMD232646C8-H
M470L3324DU0-CB3 DDR DRAM Module, 32MX64, 0.7ns, CMOS, ROHS COMPLIANT, SODIMM-200 Samsung Semiconductor HYMD232M646D6-L vs M470L3324DU0-CB3
M470L3224DT0-CA0 DDR DRAM Module, 32MX64, 0.8ns, CMOS, SODIMM-200 Samsung Semiconductor HYMD232M646D6-L vs M470L3224DT0-CA0
HYMD232M646DL6-K DDR DRAM Module, 32MX64, 0.75ns, CMOS, SODIMM-200 SK Hynix Inc HYMD232M646D6-L vs HYMD232M646DL6-K
M368L3313BT0-CA2 DDR DRAM Module, 32MX64, 0.75ns, CMOS, UDIMM-184 Samsung Semiconductor HYMD232M646D6-L vs M368L3313BT0-CA2
W3EG6432S335D4G DDR DRAM Module, 32MX64, 0.7ns, CMOS, ROHS COMPLIANT, SO-DIMM-200 Microsemi Corporation HYMD232M646D6-L vs W3EG6432S335D4G
MT8VDDT3264HG-202XX DDR DRAM Module, 32MX64, 0.8ns, CMOS, MO-224, SODIMM-200 Micron Technology Inc HYMD232M646D6-L vs MT8VDDT3264HG-202XX
HYMD532M646L6-H DDR DRAM Module, 32MX64, 0.75ns, CMOS, 67.60 X 31.75 X 3.80 MM, SODIMM-200 SK Hynix Inc HYMD232M646D6-L vs HYMD532M646L6-H
HYMD232M646CLF6-L DDR DRAM Module, 32MX64, 0.8ns, CMOS, SODIMM-200 SK Hynix Inc HYMD232M646D6-L vs HYMD232M646CLF6-L

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