Part Details for HN62314BP-17 by Hitachi Ltd
Overview of HN62314BP-17 by Hitachi Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for HN62314BP-17
HN62314BP-17 CAD Models
HN62314BP-17 Part Data Attributes:
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HN62314BP-17
Hitachi Ltd
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Datasheet
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HN62314BP-17
Hitachi Ltd
MASK ROM, 512KX8, 170ns, CMOS, PDIP32, PLASTIC, DIP-32
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | HITACHI LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 170 ns | |
| JESD-30 Code | R-PDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 41.9 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | MASK ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.00003 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for HN62314BP-17
This table gives cross-reference parts and alternative options found for HN62314BP-17. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN62314BP-17, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TC534000CP | IC 512K X 8 MASK PROM, 120 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM | Toshiba America Electronic Components | HN62314BP-17 vs TC534000CP |
| M29F040-90CM | Flash, 512KX8, 90ns, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Thales Group | HN62314BP-17 vs M29F040-90CM |
| SST39SF040-70-4C-PHE | Flash, 512KX8, 70ns, PDIP32, ROHS COMPLIANT, PLASTIC, MO-015AP, DIP-32 | Silicon Storage Technology | HN62314BP-17 vs SST39SF040-70-4C-PHE |
| M29F040B70P6T | 512KX8 FLASH 5V PROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | STMicroelectronics | HN62314BP-17 vs M29F040B70P6T |
| MR27V401D-XXRA | MASK ROM, 512KX8, 80ns, CMOS, PDIP32, PLASTIC, DIP-32 | OKI Electric Industry Co Ltd | HN62314BP-17 vs MR27V401D-XXRA |
| FTE512S8N-25I | 512KX8 EEPROM 5V, 250ns, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Force Technologies Ltd | HN62314BP-17 vs FTE512S8N-25I |
| M29F040-90CV | Flash, 512KX8, 90ns, CDIP32 | Thales Group | HN62314BP-17 vs M29F040-90CV |
| AM29F004BT-55PC | Flash, 512KX8, 55ns, PDIP32, PLASTIC, DIP-32 | AMD | HN62314BP-17 vs AM29F004BT-55PC |
| MR27V401ERA | OTP ROM, 512KX8, 70ns, CMOS, PDIP32, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-32 | OKI Electric Industry Co Ltd | HN62314BP-17 vs MR27V401ERA |
| AM29F040B-150PF | Flash, 512KX8, 150ns, PDIP32, LEAD FREE, PLASTIC, MO-015AP, DIP-32 | AMD | HN62314BP-17 vs AM29F040B-150PF |