Part Details for HN62302BP-20 by Hitachi Ltd
Overview of HN62302BP-20 by Hitachi Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Part Details for HN62302BP-20
HN62302BP-20 CAD Models
HN62302BP-20 Part Data Attributes
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HN62302BP-20
Hitachi Ltd
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Datasheet
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HN62302BP-20
Hitachi Ltd
MASK ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | HITACHI LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-PDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 41.9 mm | |
| Memory Density | 2097152 bit | |
| Memory IC Type | MASK ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.00003 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for HN62302BP-20
This table gives cross-reference parts and alternative options found for HN62302BP-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN62302BP-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MS312002-20PC | MASK ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 | Mosel Vitelic Corporation | HN62302BP-20 vs MS312002-20PC |
| KM23C2000-20 | MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Samsung Semiconductor | HN62302BP-20 vs KM23C2000-20 |
| S632000C-C | MASK ROM, 256KX8, 200ns, CMOS, CDIP32 | Gould Ami | HN62302BP-20 vs S632000C-C |
| HN62302BP-20 | 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 | Renesas Electronics Corporation | HN62302BP-20 vs HN62302BP-20 |
| MX23C2000PC-20 | MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Macronix International Co Ltd | HN62302BP-20 vs MX23C2000PC-20 |
| MB832000-20M | 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 | FUJITSU Limited | HN62302BP-20 vs MB832000-20M |
| MB832000-20P | 256KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 | FUJITSU Limited | HN62302BP-20 vs MB832000-20P |
| HM23C2002AP-20 | MASK ROM, 256KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Hualon Microelectronics Corp | HN62302BP-20 vs HM23C2002AP-20 |