Datasheets
HN27C256AG-15 by:

32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, CERDIP-28

Part Details for HN27C256AG-15 by Renesas Electronics Corporation

Overview of HN27C256AG-15 by Renesas Electronics Corporation

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for HN27C256AG-15

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HN27C256AG-15 Part Data Attributes:

HN27C256AG-15 Renesas Electronics Corporation
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HN27C256AG-15 Renesas Electronics Corporation 32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, CERDIP-28
Part Life Cycle Code Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP
Part Package Code DIP
Package Description WDIP,
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 150 ns
JESD-30 Code R-GDIP-T28
Length 36.83 mm
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.89 mm
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HN27C256AG-15

This table gives cross-reference parts and alternative options found for HN27C256AG-15. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27C256AG-15, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C256-150DCB UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD HN27C256AG-15 vs AM27C256-150DCB
AM27C256-150DCB UVPROM, 32KX8, 150ns, CMOS, CDIP28, DIP-28 Spansion HN27C256AG-15 vs AM27C256-150DCB
M27C256B-25XF3 32KX8 UVPROM, 150ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 STMicroelectronics HN27C256AG-15 vs M27C256B-25XF3
27C256-15I/J 32K X 8 UVPROM, 150 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc HN27C256AG-15 vs 27C256-15I/J
AM27C256-150DI UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD HN27C256AG-15 vs AM27C256-150DI
TMS27C256-15JL4 32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments HN27C256AG-15 vs TMS27C256-15JL4
CY27C256A-150WMB UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 Cypress Semiconductor HN27C256AG-15 vs CY27C256A-150WMB
NM27C256QE150 32KX8 UVPROM, 150ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments HN27C256AG-15 vs NM27C256QE150
AM27C256-155DIB UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD HN27C256AG-15 vs AM27C256-155DIB
CY27C256A-150WC UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 Cypress Semiconductor HN27C256AG-15 vs CY27C256A-150WC
Part Number Description Manufacturer Compare
M27C256B-20F6 32KX8 UVPROM, 150ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 STMicroelectronics HN27C256AG-15 vs M27C256B-20F6
FT27C256R-15DM/883 UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Force Technologies Ltd HN27C256AG-15 vs FT27C256R-15DM/883
AM27C256-150DIB UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD HN27C256AG-15 vs AM27C256-150DIB
M87C257-20F1X 32KX8 UVPROM, 150ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics HN27C256AG-15 vs M87C257-20F1X
SMJ27C256-1JM UVPROM, Rochester Electronics LLC HN27C256AG-15 vs SMJ27C256-1JM
M27C256B-25F7X 32KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 STMicroelectronics HN27C256AG-15 vs M27C256B-25F7X
NMC27C256BQE150 IC 32K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation HN27C256AG-15 vs NMC27C256BQE150
AM27C256-155DC UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD HN27C256AG-15 vs AM27C256-155DC
M27C256B-15F7X 32KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 STMicroelectronics HN27C256AG-15 vs M27C256B-15F7X
AM27C256-150DE UVPROM, 32KX8, 150ns, CMOS, CDIP28, DIP-28 Spansion HN27C256AG-15 vs AM27C256-150DE

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