Part Details for AM27C256-150DCB by AMD
Overview of AM27C256-150DCB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AM27C256-55DM/B | Rochester Electronics | AM27C256 - 256K (32KX8) CMOS EPROM | |
| AM27C256-120PC-G | Rochester Electronics | AM27C256 - 256Kb (32K x 8-Bit) CMOS OTP EPROM | |
| AM27C256-150DI | Rochester Electronics LLC | Replacement for AMD part number AM27C256-150DI. Buy from authorized manufacturer Rochester Electronics. |
Part Details for AM27C256-150DCB
AM27C256-150DCB CAD Models
AM27C256-150DCB Part Data Attributes
|
|
AM27C256-150DCB
AMD
Buy Now
Datasheet
|
Compare Parts:
AM27C256-150DCB
AMD
UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 150 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.1475 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.75 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C256-150DCB
This table gives cross-reference parts and alternative options found for AM27C256-150DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-150DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M27C256B-25XF6 | 32KX8 UVPROM, 150ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C256-150DCB vs M27C256B-25XF6 |
| AM27C256-150DEB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-150DCB vs AM27C256-150DEB |
| M27C256B-15F7X | 32KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | AM27C256-150DCB vs M27C256B-15F7X |
| NMC27C256BQM150 | IC 32K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-150DCB vs NMC27C256BQM150 |
| NM27C256QE150 | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | Fairchild Semiconductor Corporation | AM27C256-150DCB vs NM27C256QE150 |
| M27C256B-25F6 | 32KX8 UVPROM, 150ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C256-150DCB vs M27C256B-25F6 |
| AM27C256-150DI | UVPROM, 32KX8, 150ns, CMOS, CDIP28, CERAMIC, DIP-28 | Spansion | AM27C256-150DCB vs AM27C256-150DI |
| AM27C256-150DIB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, DIP-28 | Spansion | AM27C256-150DCB vs AM27C256-150DIB |
| AM27C256-155DIB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-150DCB vs AM27C256-155DIB |
| M27C256B-25F3 | 32KX8 UVPROM, 150ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C256-150DCB vs M27C256B-25F3 |