Part Details for AM27C256-155DIB by AMD
Overview of AM27C256-155DIB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for AM27C256-155DIB
AM27C256-155DIB CAD Models
AM27C256-155DIB Part Data Attributes:
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AM27C256-155DIB
AMD
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Datasheet
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AM27C256-155DIB
AMD
UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 150 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Length | 37.1475 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C256-155DIB
This table gives cross-reference parts and alternative options found for AM27C256-155DIB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-155DIB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C256-150DCB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-155DIB vs AM27C256-150DCB |
| AM27C256-150DCB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, DIP-28 | Spansion | AM27C256-155DIB vs AM27C256-150DCB |
| M27C256B-25XF3 | 32KX8 UVPROM, 150ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C256-155DIB vs M27C256B-25XF3 |
| 27C256-15I/J | 32K X 8 UVPROM, 150 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | AM27C256-155DIB vs 27C256-15I/J |
| AM27C256-150DI | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-155DIB vs AM27C256-150DI |
| TMS27C256-15JL4 | 32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AM27C256-155DIB vs TMS27C256-15JL4 |
| CY27C256A-150WMB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | Cypress Semiconductor | AM27C256-155DIB vs CY27C256A-150WMB |
| NM27C256QE150 | 32KX8 UVPROM, 150ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-155DIB vs NM27C256QE150 |
| CY27C256A-150WC | UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | Cypress Semiconductor | AM27C256-155DIB vs CY27C256A-150WC |
| AM27C256-150DEB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-155DIB vs AM27C256-150DEB |