Part Details for HN27C101AP-12 by Hitachi Ltd
Overview of HN27C101AP-12 by Hitachi Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for HN27C101AP-12
HN27C101AP-12 CAD Models
HN27C101AP-12 Part Data Attributes:
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HN27C101AP-12
Hitachi Ltd
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Datasheet
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HN27C101AP-12
Hitachi Ltd
OTP ROM, 128KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | HITACHI LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 120 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 41.9 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.001 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for HN27C101AP-12
This table gives cross-reference parts and alternative options found for HN27C101AP-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27C101AP-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HN27C301AP-12 | 128KX8 OTPROM, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Renesas Electronics Corporation | HN27C101AP-12 vs HN27C301AP-12 |
| AM27C010-120PC | OTP ROM, 128KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 | Spansion | HN27C101AP-12 vs AM27C010-120PC |
| AM27C010-120PI | OTP ROM, 128KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 | Spansion | HN27C101AP-12 vs AM27C010-120PI |
| HN27C101AP-12 | 128KX8 OTPROM, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Renesas Electronics Corporation | HN27C101AP-12 vs HN27C101AP-12 |
| TC541000AP-12 | IC 128K X 8 OTPROM, 120 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM | Toshiba America Electronic Components | HN27C101AP-12 vs TC541000AP-12 |
| AT27LV010-12PC | OTP ROM, 128KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Atmel Corporation | HN27C101AP-12 vs AT27LV010-12PC |
| AT27LV010-12PI | OTP ROM, 128KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Atmel Corporation | HN27C101AP-12 vs AT27LV010-12PI |