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Memory / SRAMs / GS8662Q36BGD-300
Datasheets
GS8662Q36BGD-300 by: GSI Technology

QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS8662Q36BGD-300 by GSI Technology

Overview of GS8662Q36BGD-300 by GSI Technology

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Applications Consumer Electronics Education and Research Internet of Things (IoT) Smart Cities Aerospace and Defense Agriculture Technology Robotics and Drones

Price & Stock for GS8662Q36BGD-300

Part # Distributor Description Stock Price Buy
DISTI # GS8662Q36BGD-300
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Tray - Trays (Alt: GS8662Q36BGD-300) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 144 $85.8330
  • 288 $84.2724
  • 576 $80.1108
  • 864 $78.0300
  • 1,152 $75.4290
  • 1,440 $71.7876
  • 14,400 $69.7068
$69.7068 / $85.8330 Buy Now
DISTI # 464-GS8662Q36BGD-300
Mouser Electronics SRAM 1.8 or 1.5V 2M x 36 72M RoHS: Compliant 0
  • 15 $81.5400
  • 30 $79.7400
  • 60 $78.0700
  • 105 $68.3400
$68.3400 / $81.5400 Order Now
DISTI # GS8662Q36BGD-300
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Tray - Trays (Alt: GS8662Q36BGD-300) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 144 $85.8330
  • 288 $84.2724
  • 576 $80.1108
  • 864 $78.0300
  • 1,152 $75.4290
  • 1,440 $71.7876
  • 14,400 $69.7068
$69.7068 / $85.8330 Buy Now

Part Details for GS8662Q36BGD-300

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GS8662Q36BGD-300 Part Data Attributes:

Parametric Data
GS8662Q36BGD-300 GSI Technology
Buy Now Datasheet
Compare Parts:
GS8662Q36BGD-300 GSI Technology QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 75497472 bit
Memory IC Type QDR SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 1.7 V
Supply Current-Max 1.06 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

Alternate Parts for GS8662Q36BGD-300

This table gives cross-reference parts and alternative options found for GS8662Q36BGD-300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662Q36BGD-300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8662Q36BD-300M QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q36BGD-300 vs GS8662Q36BD-300M
CY7C1514KV18-300BZXI QDR II SRAM, 2MX36, 0.45ns, CMOS, PBGA165, Infineon Technologies AG GS8662Q36BGD-300 vs CY7C1514KV18-300BZXI
GS8662Q36BGD-300I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q36BGD-300 vs GS8662Q36BGD-300I
GS8662Q36BD-300I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q36BGD-300 vs GS8662Q36BD-300I
Part Number Description Manufacturer Compare
CY7C1515KV18-250BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Infineon Technologies AG GS8662Q36BGD-300 vs CY7C1515KV18-250BZI
GS8662T36BD-300 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q36BGD-300 vs GS8662T36BD-300
GS8662D36BD-300 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q36BGD-300 vs GS8662D36BD-300
GS8662D36BGD-250 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q36BGD-300 vs GS8662D36BGD-250
GS8662D36BD-250 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q36BGD-300 vs GS8662D36BD-250
IS61QDB42M36A-300M3L QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc GS8662Q36BGD-300 vs IS61QDB42M36A-300M3L
GS8662T36BD-250I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q36BGD-300 vs GS8662T36BD-250I
CY7C1515KV18-300BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Infineon Technologies AG GS8662Q36BGD-300 vs CY7C1515KV18-300BZI
GS8662T36BGD-333I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q36BGD-300 vs GS8662T36BGD-333I
CY7C1515KV18-250BZC QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Infineon Technologies AG GS8662Q36BGD-300 vs CY7C1515KV18-250BZC

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