Findchips: Parametric Search Results for GS8662Q36BGD-300


Select Parts		Part Number

		GS8662Q36BGD-300IT GSI Technology
		GS8662Q36BGD-300T GSI Technology
		GS8662Q36BGD-300 GSI Technology
		GS8662Q36BGD-300I GSI Technology

				Most Relevant						Technical															Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price

Yes

Active

75.4975 Mbit

2MX36

1.8 V

450 ps

300 MHz

QDR SRAM

PIPELINED ARCHITECTURE

SEPARATE

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.07 mA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Active

75.4975 Mbit

2MX36

1.8 V

450 ps

300 MHz

QDR SRAM

PIPELINED ARCHITECTURE

SEPARATE

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.06 mA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Active

75.4975 Mbit

2MX36

1.8 V

450 ps

300 MHz

QDR SRAM

PIPELINED ARCHITECTURE

SEPARATE

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.06 mA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA, BGA165,11X15,40

165

compliant

3A991.B.2.B

8542.32.00.41

Check for Price

Yes

Active

75.4975 Mbit

2MX36

1.8 V

450 ps

300 MHz

QDR SRAM

PIPELINED ARCHITECTURE

SEPARATE

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.07 mA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA, BGA165,11X15,40

165

compliant

3A991.B.2.B

8542.32.00.41

GSI TECHNOLOGY

Compare

GS8662Q36BGD-300IT

GSI Technology

Check for Price

Yes

Active

75.4975 Mbit

2MX36

1.8 V

450 ps

300 MHz

QDR SRAM

PIPELINED ARCHITECTURE

SEPARATE

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.07 mA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

GS8662Q36BGD-300T

GSI Technology

Check for Price

Yes

Active

75.4975 Mbit

2MX36

1.8 V

450 ps

300 MHz

QDR SRAM

PIPELINED ARCHITECTURE

SEPARATE

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.06 mA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

GS8662Q36BGD-300

GSI Technology

Check for Price

Yes

Active

75.4975 Mbit

2MX36

1.8 V

450 ps

300 MHz

QDR SRAM

PIPELINED ARCHITECTURE

SEPARATE

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.06 mA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA, BGA165,11X15,40

165

compliant

3A991.B.2.B

8542.32.00.41

GS8662Q36BGD-300I

GSI Technology

Check for Price

Yes

Active

75.4975 Mbit

2MX36

1.8 V

450 ps

300 MHz

QDR SRAM

PIPELINED ARCHITECTURE

SEPARATE

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.07 mA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA, BGA165,11X15,40

165

compliant

3A991.B.2.B

8542.32.00.41

GSI TECHNOLOGY

Parametric results for: GS8662Q36BGD-300 under SRAMs