Part Details for DPS256X32BV3-30C by B&B Electronics Manufacturing Company
Overview of DPS256X32BV3-30C by B&B Electronics Manufacturing Company
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DPS256X32BV3-30C
DPS256X32BV3-30C CAD Models
DPS256X32BV3-30C Part Data Attributes
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DPS256X32BV3-30C
B&B Electronics Manufacturing Company
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Datasheet
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DPS256X32BV3-30C
B&B Electronics Manufacturing Company
SRAM Module, 256KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | DPAC TECHNOLOGIES CORP | |
| Part Package Code | PGA | |
| Package Description | PGA, | |
| Pin Count | 66 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 30 ns | |
| Alternate Memory Width | 16 | |
| JESD-30 Code | S-CPGA-P66 | |
| Memory Density | 8388608 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX32 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 10.16 mm | |
| Standby Voltage-Min | 2 V | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR |
Alternate Parts for DPS256X32BV3-30C
This table gives cross-reference parts and alternative options found for DPS256X32BV3-30C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS256X32BV3-30C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS256X32BV3-30B | SRAM Module, 256KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS256X32BV3-30C vs DPS256X32BV3-30B |
| DPS256X32BV3-30M | SRAM Module, 256KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS256X32BV3-30C vs DPS256X32BV3-30M |
| DPS256X32BV3-30I | SRAM Module, 256KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32BV3-30C vs DPS256X32BV3-30I |
| DPS256X32BV3-30C | SRAM Module, 256KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS256X32BV3-30C vs DPS256X32BV3-30C |
| DPS256X32BV3-30I | SRAM Module, 256KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS256X32BV3-30C vs DPS256X32BV3-30I |