DPS256X32BV3-30C vs WS256K32N-25HC feature comparison

DPS256X32BV3-30C B&B Electronics Manufacturing Company

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WS256K32N-25HC White Electronic Designs Corp

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer DPAC TECHNOLOGIES CORP WHITE ELECTRONIC DESIGNS CORP
Part Package Code PGA
Package Description PGA, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Pin Count 66
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 30 ns 25 ns
Alternate Memory Width 16 16
JESD-30 Code S-CPGA-P66 S-CPGA-P66
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1
Number of Terminals 66 66
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX32 256KX32
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 10.16 mm 6.22 mm
Standby Voltage-Min 2 V 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Base Number Matches 1 2
Rohs Code No
Additional Feature CONFIGURABLE AS 256K X 32
I/O Type COMMON
JESD-609 Code e0
Length 30.1 mm
Package Equivalence Code PGA66,11X11
Standby Current-Max 0.016 A
Supply Current-Max 0.55 mA
Terminal Finish TIN LEAD
Width 30.1 mm

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