DPS256X32BV3-30C
vs
DPS256C32BV3-35C
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
DPAC TECHNOLOGIES CORP
|
DPAC TECHNOLOGIES CORP
|
| Part Package Code |
PGA
|
PGA
|
| Package Description |
PGA,
|
PGA,
|
| Pin Count |
66
|
66
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
30 ns
|
35 ns
|
| Alternate Memory Width |
16
|
16
|
| JESD-30 Code |
S-CPGA-P66
|
S-CPGA-P66
|
| Memory Density |
8388608 bit
|
8388608 bit
|
| Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
66
|
66
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256KX32
|
256KX32
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
YES
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
PGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
10.16 mm
|
11.684 mm
|
| Standby Voltage-Min |
2 V
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
CONFIGURABLE AS 1M X 8
|
|
|
|
Compare DPS256X32BV3-30C with alternatives
Compare DPS256C32BV3-35C with alternatives